Taiwan Semiconductor Manufacturing Comp. Ltd.

Ming-Hong Cha

Chen-Shien Chen

Chen-Cheng Kuo

Yao-Chun Chuang

Chita Chuang

Tsung-Hsien Chiang

Hao-Juin Liu

Ming-Da Cheng

Mirng-Ji Lii

Wen-Hsiung Lu

Yu-Feng Chen

Kuo-Ching Hsu

Hong-Seng Shue

Cheng Jen Lin

Chao-Yi Wang

Chih-Hsiang Tseng

The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.

Bonded structures for package and substrate

A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.

Semiconductor device and method of forming same

Growing community of inventors

Hsin-Chu, Taiwan

Ming-Hong Cha