Apaq Technology Co., Ltd.

Hotek Material Technology Co., Ltd.

Ming-Goo Chien

Kuo-Chen Huang

Ming-Tsung Liang

Chieh Lin

Chia-Yu Wu

Cheng-Han Tsai

Kuan-Chong Wang

Hao-Wei Fong

Shih-Shan Liu

An electromagnetic shielding element and, transmission line assembly and electronic structure package using the same are provided. The electromagnetic shielding element is applied to the transmission line assembly and the electronic structure package to shield electromagnetic noise. The electromagnetic shielding element includes a quantum well structure, and the quantum well structure includes at least two barrier layers and at least one carrier confined layer located between the two barrier layers. Each barrier layer has a thickness between 0.1 nm and 500 nm, and the thickness of the carrier confined layer is between 0.1 nm and 500 nm. The electromagnetic shielding element absorbs electromagnetic wave noise to suppress electromagnetic interference.

Electromagnetic shielding element, and transmission line assembly and electronic structure package using the same

The present invention provides a device for manufacturing a multi-layer stacked structure and a method for manufacturing a thin film capacitor. The method includes providing a carrier substrate, forming a plurality of first material layers and a plurality of second layers that are alternately stacked on top of one another to form a multi-layer stacked structure, and then forming two terminal electrode structures for respectively enclosing two opposite side portions of the multi-layer stacked structure. One of the first material layer and the second material layer has a plurality of conductive particles randomly distributed therein. The conductive particles are heated to form a spherical structure or a sphere-like structure with low melting point and high surface energy at a temperature that is smaller than the degradation temperature of polymers. Therefore, the dielectric constant of the multi-layer stacked structure and the thin film capacitor can be increased.

Device for manufacturing a multilayer stacked structure and method for manufacturing a thin film capacitor

The present disclosure provides a lithium battery and a cathode foil thereof. The cathode foil includes a base material layer, a first material layer formed on the base material layer, and a second material layer including a plurality of particle structure groups disposed inside the first material layer. Each of the particle structure groups includes a plurality of particle structures connected with each other. One of the first material layer and the second material layer is formed by a pure silicon material without impurities, and another one of the first material layer and the second material layer is formed by a pure carbon material without impurities. Therefore, the structural strength and the ion transmission efficiency of the lithium battery with the cathode foil can be increased in virtue of the particle structures that are connected with each other.

Lithium battery and cathode foil thereof

The present disclosure provides a capacitor package structure and an anti-oxidation electrode foil thereof. The anti-oxidation electrode foil includes a base material structure, a first conductive material structure, and a first carbonaceous material structure. The base material structure has a top surface and a bottom surface. The first conductive material structure is disposed on the top surface of the base material structure. The first carbonaceous material structure is disposed on the first conductive material structure. One portion of the first conductive material structure is a first oxygenated metal compound for contacting the first carbonaceous material structure. The first oxygen-containing metal compound layer is disposed between the other portion of the first conductive material structure and the first carbonaceous material structure so as to prevent oxygen from contacting the other portion of the first conductive material structure.

Capacitor package structure and anti-oxidation electrode foil thereof

The instant disclosure provides a thin film capacitor and a method of manufacturing the same. The method includes the following steps: placing a carrier substrate on a processing machine including at least one processing unit, and the at least one processing unit having a metal-layer forming module and an insulation-layer forming module that are arranged along a planar production line; forming a plurality of metal layers by the metal-layer forming module of the at least one processing unit, forming a plurality of insulation layers by the insulation-layer forming module of the at least one processing unit, and the metal layers and the insulation layers being alternately stacked on the carrier substrate to form a multilayer stacked structure; and then forming two terminal electrode structures to respectively enclose two opposite side end portions of the multilayer stacked structure.

Method of manufacturing a thin film capacitor

The instant disclosure provides a color-changeable capacitor package structure and a color-changeable capacitor casing structure thereof, and a circuit board assembly. The color-changeable capacitor casing structure includes a metal casing, a first covering layer and a second covering layer. The metal casing has an outer surface and an inner surface, and the metal casing has a receiving space for receiving a capacitor. The first covering layer is formed on the outer surface of the metal casing, the second covering layer is formed on the first covering layer, and one of the first covering layer and the second covering layer is a thermochromic layer for showing a color that is changeable according to temperature variation.

Color-changeable capacitor package structure and color-changeable capacitor casing structure thereof, and circuit board assembly

A capacitor detection system and an active-type pin-diverging module thereof are disclosed. The active-type pin-diverging module is applied to two conductive pins of a capacitor, and active-type pin-diverging module includes a base structure and a swingable structure. The swingable structure is swingably disposed on the base structure, and the swingable structure includes two swingable elements. The two conductive pins of the capacitor respectively pass through two through holes of a seat board, and each conductive pin has a lateral contact surface. The two swingable elements concurrently slidably contact the two lateral contact surfaces of the two conductive pins of the capacitor so as to diverge the two conductive pins of the capacitor, and the seat board is held by the two diverged conductive pins so as to prevent the seat board from being separated from the capacitor.

Capacitor detection system and active-type pin-diverging module thereof

An impregnation apparatus for impregnating a material in a combined medicament. The impregnation apparatus includes a delivery device, a dispensing device, a transmission device, a scraper device, and an impregnation execution device. The combined medicament is poured into a receiving unit by the dispensing device. The scraper device includes a scraper moving unit and a scraper structure arranged on the scraper moving unit. The scraper moving unit drives the scraper structure, leveling the combined medicament in the receiving unit. The impregnation execution device includes a carrying unit and a carrier moving unit. The material is disposed in the carrying unit and is impregnated into the receiving unit carrying the combined medicament by moving the carrying unit. The instant disclosure further provides an impregnation method.

Growing community of inventors

Taichung, Taiwan

Ming-Goo Chien