National Applied Research Laboratories

Ming-Fu Chen

Chi-Hung Huang

Po-Hsuan Huang

Chun-Cheng Chen

Cheng-Fang Ho

Wei-Yao Hsu

Po-Jui Chen

Yi-Hao Lin

Wei-Jei Peng

Jung-Hsin Wang

Hua-Lin Chen

Chun-Chao Chang

Zong-Ru Yu

The present disclosure illustrates a non-contact measurement device for a radius of curvature and a thickness of a lens and a measurement method thereof. The non-contact measurement device utilizes a non-contact probe to integrate a motor, an optical scale and an electronic control module, so as to achieve measurement for the radius of curvature and the thickness of the lens. The present disclosure adopts astigmatism to achieve fast and precise focusing. To overcome the spherical aberration problem, thickness measurement can be implemented by the non-contact measurement device through a formula calculation and utilization of a correction plate, wherein single one probe is used for the measurement herein. For the thicker lens, the non-contact measurement device can be extended to use dual probes, so as to detect the top and bottom sides of the lens.

Non-contact measurement device for radius of curvature and thickness of lens and measurement method thereof

The present invention discloses a time-sequential multi-spectrum image acquiring device structure which uses a single camera module to achieve multi-spectrum image acquiring in a time-sequential architecture, thereby providing a simple, lightweight telemetry system and reducing the development and operation costs thereof. For example, a visible and near infrared (VNIR) imaging system reduces the use of four camera modules (each including an optical lens, filter, sensor, and image signal processing unit) to single camera module, the VNIR imaging system acquires multi-spectrum images having the same image geometric parameters for image calibration and can simplify the calibration process. The present invention is implemented by introducing a multi-spectrum filter wheel capable of rotating in high speed in the camera module and controlling the image acquiring frequency of the sensor and the synchronicity of the wheel rotating speed for multi-spectrum image acquiring. The present invention is suitable for use in multi-spectrum images acquiring of airborne telemetry requiring lightweight system, such as multi-spectrum images acquiring of unmanned aerial vehicle (UAV).

Time-Sequential multi-spectrum imaging device

The present invention provides a method for inspecting chip defects. A raw image of a chip is used to extract a chip image. A binary chip edge image obtained from the chip image is used for inspecting defects, coordinated with statistics of edge pixels. During packaging the chip, defects that exceed inspection criteria and affect chip quality are quantitatively and accurately inspected out. The present invention has a simple procedure with high performance on inspecting defect modes and defect sizes. Thus, the present invention greatly improves performance and accuracy of inspections on chip defects for further saving a great amount of labor, time and cost.

Method of inspecting chip defects

Growing community of inventors

Hsinchu, Taiwan

Ming-Fu Chen