Walsin Advanced Electronics Ltd.

Integrated Circuit Solution Inc.

Ming-Feng Wu

Wen-Chun Liu

Yung-Chao Jen

A package structure and method for preventing gold bonding wires from collapsing are disclosed. The structure is especially useful for those chips whose two n&#xd7;1 arrays of bonding pads are on the chip center to be packaged on a BGA substrate. According to the first preferred embodiment, two dies having a redistribution layer formed thereon are introduced outer the bonding pad array on the chip so that the gold bonding wires can be divided into two sections each to connect the bonding pads with the redistribution layer and the redistribution layer with the gold fingers on the BGA substrate. According to the second embodiment, the gold bonding wires are fixed by the epoxy strips on the chips after bonding the bonding pads to the gold fingers but before pouring liquid encapsulated epoxy into a mold.

Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse

A semiconductor die package has a lead frame, a die attached to the lead frame and an encapsulant enclosing the lead frame and the die. The distance between the top outside face of the encapsulant and the frame is substantially equal to the distance between the bottom outside face of the encapsulant and the die, and the distance between the top outside face of the encapsulant and the frame is substantially two and half times the distance between the bottom outside face of the encapsulant and the lead frame. Consequently, the different thickness of different encapsulant portions achieves an optimum balance during curing that effectively reduces the deformation of the encapsulant. In addition, the encapsulant can be completely formed by an injection process, and no crack will form in the encapsulant.

Growing community of inventors

Kaohsiung Hsien, Taiwan

Ming-Feng Wu