Asustek Computer Inc.

Trend Micro Inc.

Ming-Fang Tsai

Bing-Min Lin

Ji-Kuang Tan

Ming-Hsiu Wu

Chih-Kuang Lin

Ching Ho

Teng-Liang Ng

Kuang-Yu Chang

Chang-Wei Chung

Dun-Hao Yang

Yen-Chao Huang

A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.

Heat dissipation module and electronic device having the same

A motherboard of a computer is provided. The motherboard of a computer includes a main body, a notch formed at a side edge of the main body, an auxiliary device, and a fixing device formed adjacent to the notch to fix the auxiliary device in the notch, wherein the auxiliary device is a light guiding device including patterns.

Motherboard of computer

A heat dissipating module disposed at a motherboard includes a fan, a air guiding cover, a first fin set and a second fin set. The fan provides cool air and is disposed in the air guiding cover. The air guiding cover includes a first air outlet, a second air outlet and an air guiding part connected between the first air outlet and the second air outlet. The first fin set is disposed at an upper surface of the motherboard and includes a plurality of first fins. The first air outlet covers at least a part of the first fins. The second fin set is disposed at a bottom surface opposite to the upper surface and extends to a side edge of the motherboard. The second fin set includes a plurality of second fins located beside the side edge, and the second air outlet covers the second fins.

Heat dissipating module

Methods and apparatus for transparently processing files that are manipulated between a server computer and a client computer using the CIFS protocol. The transparent processing employs an in-line CIFS proxy and may include virus scanning, content scanning, and/or security policy implementation.

CIFS proxies for scanning protection

Growing community of inventors

Taipei, Taiwan

Ming-Fang Tsai