Other

Menara Networks, Inc.

Luxar Tech Inc

Alpine Optoelectronics Inc.

Ming Ding

Tongqing Wang

Yong Li

Adam R Hotchkiss

Jinghui Li

Salam Elahmadi

Gabriel E Cardona

Siraj Nour Elahmadi

Xingyu Zhang

Dawei Zheng

Dobby Lam

Fredrick Muya

Embodiment of present invention provide an optical subassembly that includes a first, a second, and a third band filter (BF) each having a common port (CP), a port-A (PA), and a port-B (PB). The PA of the second BF is connected to the PA of the third BF and the PB of the first BF is connected to the PB of the third BF. The optical subassembly is adapted to route a first optical signal of a blue band from the PA to the CP of the first BF; to route the first optical signal from the CP of the second BF to the CP of the third BF; to route a second optical signal of a red band from the CP of the third BF to the CP of the first BF; and to route the second optical signal from the CP to the PB of the second BF.

Optical subassembly for bidirectional WDM application

A silicon photonics based single wavelength 100 Gbit/s PAM4 DWDM transceiver in a pluggable form factor having a transmitter, said transmitter having: a DWDM laser source; a fiber array pigtail having a polarization maintaining fiber and an output single mode fiber; a silicon photonics modulator chip configured to optically connect to the DWDM laser source through the usage of the polarization maintaining fiber, a modulator driver chip connected to the silicon photonics modulator chip and an LC receptacle configured to optically connect to the silicon photonics modulator chip through the usage of the output single mode fiber. The disclosed transmitter may be further comprised of a reference loop within the silicon photonics modulator chip to allow for the utilization of a passive alignment approach for optically connected elements. The disclosed transceiver may be configured for use with C-band DWDM applications for utilization in applicable technologies, including 5G telecommunications.

Silicon photonics based single-wavelength 100 gbit/S PAM4 DWDM transceiver in pluggable form factor

Embodiments of present invention provide various device assemblies for digital communication. The device assemblies may include a main printed-circuit-board (PCB); and an OSA-on-daughter-board (OODB) directly connected to the main PCB. The OODB has an optical sub-assembly (OSA) wire-bonded onto a daughter PCB. In one embodiment, the daughter PCB includes a flexible printed-circuit (FPC) sheet connecting the OODB directly to the main PCB. In another embodiment, the main PCB includes a FPC sheet connecting the main PCB directly to the OODB. In one embodiment, the connection may be made through an anisotropic conductive film or an anisotropic conductive adhesive.

Connecting optical sub-assembly to main printed circuit board

Embodiments of present invention provide a digital dispersion compensation module. The digital dispersion compensation module includes a multi-port optical circulator and a plurality of dispersion compensation units connected to the multi-port optical circulator, wherein at least one of the plurality of dispersion compensation units includes a first and a second reflectively terminated element and an optical switch being capable of selectively connecting to one of the first and second reflectively terminated elements, and wherein the at least one of the plurality of dispersion compensation units is adapted to provide a substantially zero dispersion to an optical signal, coming from the multi-port optical circulator, when the optical switch connects to the first reflectively terminated element and is adapted to provide a non-zero dispersion to the optical signal when the optical switch connects to the second reflectively terminated element.

Digital dispersion compensation module

Integrated performance monitoring (PM); optical layer operations, administration, maintenance, and provisioning (OAM&P); alarming; amplification, or the like is described in optical transceivers, such as multi-source agreement (MSA)-defined modules. An optical transceiver defined by an MSA agreement can include advanced integrated functions for carrier-grade operation which preserves the existing MSA specifications allowing the optical transceiver to operate with any compliant MSA host device with advanced features and functionality. An XFP module can include integrated circuitry configured to provide forward error correction encoding and decoding; a transmitter communicatively coupled to the integrated circuit; a receiver communicatively coupled to the integrated circuit; and a module housing in which the integrated circuitry, the transmitter, and the receiver are disposed, wherein the module housing is pluggable in a host device configured to operate the pluggable optical transceiver, and wherein the forward error correction encoding and decoding is performed transparently to the host device.

Extended reach XFP transceiver with integrated forward error correction

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Bellevue, WA, United States of America

Ming Ding