Average Co-Inventor Count = 5.65
ph-index = 15
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (390 from 40,053 patents)
389 patents:
1. 12431365 - Bump structure and method of making the same
2. 12431446 - Package structure
3. 12426284 - Semiconductor device with inductive component and method of forming
4. 12417992 - Chip structure with conductive pillar and method for forming the same
5. 12412858 - Semiconductor device structure with conductive bumps
6. 12394736 - Semiconductor package system and method
7. 12381171 - Semiconductor die including stress-resistant bonding structures and methods of forming the same
8. 12374639 - Non-DMSO stripper for advance package metal plating process
9. 12368120 - Semiconductor device and method
10. 12300644 - Die bonding pads and methods of forming the same
11. 12300580 - Semiconductor device and method
12. 12300652 - Substrate and package structure
13. 12288730 - Semiconductor device, semiconductor package, and methods of manufacturing the same
14. 12272664 - Semiconductor packages having conductive pillars with inclined surfaces
15. 12255131 - Capacitor between two passivation layers with different etching rates