Average Co-Inventor Count = 5.65
ph-index = 15
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (393 from 40,283 patents)
392 patents:
1. 12444706 - Package bonding structures and method of formation
2. 12438048 - Redistribution lines with protection layers and method forming same
3. 12431365 - Bump structure and method of making the same
4. 12431446 - Package structure
5. 12426284 - Semiconductor device with inductive component and method of forming
6. 12417992 - Chip structure with conductive pillar and method for forming the same
7. 12412858 - Semiconductor device structure with conductive bumps
8. 12394736 - Semiconductor package system and method
9. 12381171 - Semiconductor die including stress-resistant bonding structures and methods of forming the same
10. 12374639 - Non-DMSO stripper for advance package metal plating process
11. 12368120 - Semiconductor device and method
12. 12300644 - Die bonding pads and methods of forming the same
13. 12300580 - Semiconductor device and method
14. 12300652 - Substrate and package structure
15. 12288730 - Semiconductor device, semiconductor package, and methods of manufacturing the same