Unimicron Technology Corporation

Other

Taiwan Mask Corporation

Young Optics Inc.

Adl Engineering Inc.

Ming-Chih Chen

Dyi-Chung Hu

Tzyy-Jang Tseng

Ya-Ling Hsu

Yu-Shan Hu

Hsiang-Jen Yang

Chen-Rui Tseng

An image displacement device includes a first grating and a second grating. Each grating is switchable between a diffracting state and a non-diffracting state. The first grating has a first surface and a second surface opposite the first surface, the first surface receives image beams, and the image beams leave the first grating by the second surface. The second grating is disposed downstream from the first grating in a light path and has a third surface and a fourth surface opposite the third surface. The third surface receives the image beams, and the image beams leave the second grating by the fourth surface. An exit direction of the image beam exiting the second grating is shifted a distance in a first direction from an incident direction of the image beam incident to the first grating.

Image displacement device

An image displacement device includes a projection lens and a first grating. The projection lens has a lens group, and the lens group includes a first lens and a second lens, where no lens with refractive power is disposed between the first lens and the second lens. The first grating is switchable between a diffracting state and a non-diffracting state, and the first grating is disposed on one side of the first lens facing away from the second lens. A distance between the first grating and an aperture stop of the projection lens measured along an optical axis of the projection lens is smaller than a distance between the first grating and the second lens measured along the optical axis of the projection lens.

A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal cattier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads. An upper surface of the insulating material layer and a top surface of each conductive pillar are coplanar. The metal carrier is removed to expose a lower surface of the insulating material layer.

Manufacturing method of interposed substrate

A manufacturing method of an interposed substrate is provided. A metal-stacked layer comprising a first metal layer, an etching stop layer and a second metal layer is formed. A patterned conductor layer is formed on the first metal layer, wherein the patterned conductor layer exposes a portion of the first metal layer. A plurality of conductive pillars is formed on the patterned conductor layer, wherein the conductive pillars are separated from each other and stacked on a portion of the patterned conductor layer. An insulating material layer is formed on the metal-stacked layer, wherein the insulating material layer covers the portion of the first metal layer and encapsulates the conductive pillars and the other portion of the patterned conductor layer. The metal-stacked layer is removed to expose a lower surface opposite to an upper surface of the insulating material layer and a bottom surface of the patterned conductor layer.

A packaging carrier includes an interposer, a dielectric layer and a built-up structure. The interposer has a first surface and a second surface opposite to each other, and a plurality of first pads and second pads located on the first surface and the second surface, respectively. The dielectric layer has a third surface and a fourth surface opposite to each other. The interposer is embedded in the dielectric layer. The second surface of the interposer is not covered by the fourth surface of the dielectric layer, and has a height difference with the fourth surface. The built-up structure is disposed on the third surface of the dielectric layer and electrically connected to the first pads of the interposer.

Packaging carrier and manufacturing method thereof and chip package structure

Interposed substrate and manufacturing method thereof

A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal carrier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads. An upper surface of the insulating material layer and a top surface of each conductive pillar are coplanar. The metal carrier is removed to expose a lower surface of the insulating material layer.

A method for testing a mask article includes steps of electrically connecting the mask article to an electrical sensor, applying a bias voltage to a plurality of testing sites of the mask article with a conductor, measuring at least one current distribution of the testing sites with the electrical sensor, and determining the quality of the mask article by taking the at least one current distribution into consideration.

Method for testing mask articles

A method for testing a mask article includes the steps of electrically connecting the mask article to an electrical sensor, applying a bias voltage to a plurality of testing sites of the mask article with a conductor, measuring at least one current distribution of the testing sites with the electrical sensor, and determining the quality of the mask article by taking the at least one current distribution into consideration.

The conductive line structure of a semiconductor device including a base; at least one patterned conductive layer formed over the base; a conductive line formed over the at least one patterned conductive layer; a protection layer that encompasses the top surface and sidewall of the conductive line to prevent undercut generated by etching. The structure further comprises an underlying layer under the conductive line. The underlying layer includes Ni, Cu or Pt. The conductive line includes gold or copper. The at least one patterned conductive layer includes at least Ti/Cu. The protection layer includes electro-less plating Sn, Au, Ag or Ni.

Conductive line structure and the method of forming the same

A dual functional lamp includes a lamp shade, a dual light seat unit mounted in the lamp shade, and a dual light bulb unit mounted on the dual light seat unit and located in the lamp shade. Thus, the dual light bulb unit can emit optical rays outward to provide a warming and illuminating effect and can also emit ultraviolet rays outward, so that the single dual light bulb unit produces two different functions, thereby enhancing the versatility of the dual functional lamp. In addition, the dual light bulb unit is fully hidden in the lamp shade, so that the dual functional lamp has a smaller volume, thereby saving the space of storage, and thereby facilitating storage, package and transportation of the dual functional lamp.

Reptile dual functional lamp

A name card image obtaining device mainly comprises a hollow housing, an image obtaining device and a name card holding device. The hollow housing has a first end and a second end. Several homogeneous light generating sections are disposed near the first end. The image obtaining device is disposed on the first end of the hollow housing. This image obtaining includes at least one connecting port. The name card holding device is disposed on the second end to hold a name card. So, its advantages include no light spot problem on the name card image, fixed focus with micro-adjustable focus mechanism and ease of inserting/drawing name card.

Name card image obtaining device

An aquarium light fixture includes a plural number of brackets for supporting an aquarium light assembly on an aquarium. Each bracket includes a base, a pair of arms in U-shaped and a slide block at the top of each arm. The slide block is slidably engageable with a longitudinal groove formed in each of two lateral side walls of the light assembly. The base further has a plural number of spaced wedge feet extending downward for clamping a top portion of the aquarium slidewall. Therefore two brackets mounting on two opposite sidewalls may support the aquarium light assembly like a bridge manner. The bracket may be adapted easily and flexibly to different size of aquariums.

Growing community of inventors

Hsinchu, Taiwan

Ming-Chih Chen