Taiwan Semiconductor Manufacturing Comp. Ltd.

Ming-Chih Chang

Hua-Shu Ivan Wu

Tsung-Mu Lai

Che-Rong Laing

Tsong-Mu Lai

H Shu Wu

Tsang-Mu Lai

A method and a structure are provided for preventing lift-off of a semiconductor monitor pattern from a substrate. A semiconductor structure and a semiconductor monitor structure are formed on a substrate. A material layer is formed covering the semiconductor monitor structure. A part of the semiconductor structure is removed without removing the semiconductor monitor structure, by using the material layer as an etch protection layer. A mask for the method is also provided. The mask includes a clear area and a dark area. The dark area prevents a semiconductor monitor structure from being subjected to exposure so as to form a material layer covering the semiconductor monitor structure and prevent removal of the semiconductor monitor structure from the substrate while a part of a semiconductor structure is removed.

Semiconductor structures

A method of manufacturing a micro-lens is disclosed. The method includes providing a convex photoresist surface, forming a lens mold on the convex photoresist surface, removing the lens mold from the convex photoresist surface, forming a micro-lens in the lens mold and removing the micro-lens from the lens mold.

Micro-lens and micro-lens fabrication method

An ink-ejection unit of an inkjet printhead integrates an ink-channel wafer onto a CMOS wafer with a heating element fabricated therein. A nozzle film with a nozzle orifice is formed on the backside of the CMOS wafer, which allows two-dimensional ink ejecting from the backside of the CMOS wafer.

Ink-channel wafer integrated with CMOS wafer for inkjet printhead and fabrication method thereof

Semiconductor methods and structures

A method for forming a free standing micro-structural member including providing a substrate; blanket depositing a first sacrificial resist layer over the substrate; exposing and developing the first sacrificial resist layer to form a first resist portion; subjecting the first resist portion to at least a hard bake process to form the first resist portion having a predetermined first smaller volume compared to a desired final resist portion volume; blanket depositing at least a second sacrificial resist layer followed by exposure, development and the at least a hard bake process to form the final resist portion volume; and, depositing at least one structural material layer over the final resist portion.

Method for manufacturing MEMS structures

A method for fabricating micro pipes on a semiconductor wafer or other substrate. According to the method of the invention, a base layer is initially deposited on the substrate and then etched to form a trench which exposes the surface of the substrate. Next, a PR (photoresist) layer of selected thickness is deposited over the base layer and the trench. Finally, in a curing step, the deposited photoresist is irradiated with ionizing radiation to cause outgassing of nitrogen gas from the photoresist layer, between the PR layer and the substrate. This step facilitates buckling of the PR layer into an arcuate bubble which defines the semispherical micro pipe structure.

Micro pipe manufacturing method

A method for producing a spheroidal shaped micro-array assembly including providing a substrate having frontside patterned openings formed in the substrate; blanket depositing a photosensitive layer over the substrate including the frontside patterned openings; exposing the photosensitive layer to ionizing radiation for a predetermined period of time to produce outgassing to separate the photosensitive layer and substrate to produce a spheroidal shaped photosensitive layer portion; blanket depositing a mirror layer over the photoresist layer to preserve the spheroidal shaped photosensitive layer portion; and removing the photosensitive layer.

Growing community of inventors

Sinyuan Township, Pingtung County, Taiwan

Ming-Chih Chang