Mpi Corporation

Mjc Probe Incorporation

Ming-Chi Chen

Chien-Chou Wu

Tsung-Yi Chen

Chung-Che Li

Tien-Chia Li

Hendra Sudin

Hsin-Hung Lin

Wei-Cheng Ku

Che-Wei Lin

Horng-Kuang Fan

Chung-Tse Lee

Chia-Yuan Kuo

Chien-Kuei Wang

Mao-Fa Shen

Shih-Chang Wu

Shih-Cheng Wu

Dai-Jin Yeh

Chien-Liang Chen

Ming-Chu Chueh

Bang-Shun Liu

A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.

Wafer testing probe card

An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

Assembly method of direct-docking probing device

A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan.

Probe needle and probe module using the same

A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.

Probing device

The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against plural probes.

Probe card and manufacturing method thereof

A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

Probing device and manufacturing method thereof

A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.

Probe head of probe card and manufacturing method of composite board of probe head

A vertical probe device includes two guide members arranged in a stack manner and defining therebetween an accommodation chamber, a probe holder plate disposed between the guide members, and a plurality of probes inserted through the guide plates and the probe holder plate in such a manner that the probes are flexible within the accommodation chamber. One of the guide plates has at least one through hole. The probe holder plate is slightly moveable in horizontal and vertical directions but fixable to one of the guide plats under a force applied through the at least one through hole to the probe holder plate while the other of the guide plates is removed, thereby preventing damage of the probes or movement of the probes during a maintenance work.

Vertical probe device

A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, which is arranged at the bottom side of the circuit board and has an upper guide plate, a lower guide plate, a conducting layer provided on the lower guide plate, a plurality of signal probes respectively electrically connected to the signal circuits and adjacent to a plurality of compensation probes, and at least one grounding probe electrically connected to the grounding circuits in a manner that the signal, compensation and grounding probes are vertically inserted through the upper and lower guide plates, and the conducting layer is conducted with the compensation probe and the grounding probe while electrically insulated to the signal probe.

Growing community of inventors

Hsinchu Hsiang, Taiwan

Ming-Chi Chen