Siliconware Precision Industries Co., Ltd.

Ming Cheng Lin

Hung-Wen Liu

Lien-Chen Chiang

Wen-Shan Tsai

Chien-Feng Wei

A lead frame structure is provided, which includes a die pad having a first mounting portion and a second mounting portion separated from the first mounting portion by a gap. The first and second mounting portions are formed with corresponding blocking surfaces bordering the gap, so as to allow a flow rate of an encapsulating resin flowing through the gap during a molding process to be reduced by the blocking surfaces, such that different portions of the encapsulating resin respectively flowing above, in and below the die pad can have substantially the same flow rate, thereby preventing bonding wires from being deformed to cause short circuit and avoiding formation of voids. A semiconductor package with the lead frame structure is also provided.

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Taichung, Taiwan

Ming Cheng Lin