Taiwan Semiconductor Manufacturing Comp. Ltd.

Ming-Cheng Hsu

Mill-Jer Wang

Wen-Tsai Su

Clinton Chih-Chieh Chao

Chun-Hsing Chen

Te-Kun Lin

Wen-Chun Tu

Sheng-Hsi Huang

Yu-Hsien Tsai

Fei-Chieh Yang

Wen-Feng Liao

Yuan-Pin Huang

A method for detecting a contact force of a probe card is provided. The method includes contacting a pressure film sensor with a plurality of needles over a lower surface of the probe card. The method includes detecting the contact force of the probe card via the pressure film sensor. The method also includes adjusting a position of a push base over an upper surface of the probe card based on the detected contact force of the pressure film sensor.

Method for detecting contact force of probe card

A method for retrieving a probe pin includes following operations. A probe head is received in a carrier. The probe head includes an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die. A first bending delta between a probe tip of the probe pin and a pin tip of the probe pin is measured. The probe pin is bended by a bending fixture when the first bending delta is greater than a value to obtain a second bending delta between the pin tip and the pin head. The probe pin is pushed in the direction from the lower die to the upper die by a plate. The probe pin is picked from the probe head by an arm.

Method for probe pin retrieval

A probe assembly includes a multilayer structure including probe contact pads, an upper guide plate including an array of upper holes therethrough, a lower guide plate including an array of lower holes therethrough, a vertical stack of a plurality of dielectric spacer plates located between the upper guide plate and the lower guide plate and including a respective opening therethrough, and an array of probes attached to the probe contact pads, vertically extending through the array of upper holes and the array of lower holes, and vertically extending through the openings through the vertical stack of the plurality of dielectric spacer plates.

Probe assembly with multiple spacers and methods of assembling the same

An apparatus is provided. The apparatus includes a stage and a plate disposed on the stage. The apparatus further includes a pressure film sensor that is formed on the plate and configured to detect a contact force between a plurality of needles on a probe head of a probe card and the pressure film sensor. The apparatus still includes a distance detector that is configured to detect a distance between the pressure film sensor and the needles. In addition, the apparatus includes an adjustment driver that is configured to adjust the probe card based on the detected contact force of the pressure film sensor.

Probe card, apparatus and method for detecting contact force of probe card

A probe head and methods of testing a device using a probe head are provided. The probe head includes a first end connected to a first substrate. The first substrate is configured to be connected to a test head. The probe head also includes second end having a first inner recess surrounded by a first protrusion and a first plurality of probe needles connected to the first protrusion.

Probe head structure of probe card and testing method

The present disclosure relates to a probe head receiver, which includes: a first template, a guide plate and a spacer. The first template has a number of apertures of a first size. The guide plate has a number of apertures of a second size, each of the number of apertures of the first template is aligned with each of the number of apertures of the guide plate. The spacer is between the first template and the guide place. The second size is different from the first size.

Probe head receiver and probe card assembly having the same

An apparatus and a method are disclosed herein. The apparatus includes a circuit board, a housing, a spacer and a pin. The circuit board is configured to test a device-under-test (DUT). The housing includes a raised portion and a supporting portion. The spacer is mounted on the supporting portion of the housing. The pin penetrates through the raised portion and the supporting portion of the housing, and is configured to electrically connect the circuit board to the DUT.

Probe card

An apparatus includes a membrane film and a plurality of needle tips with cylinder shapes. The membrane film includes a plurality of signal traces. The needle tips are disposed on the membrane film and are electrically connected to the signal traces. The needle tips are configured to probe a device-under-test (DUT).

Membrane probe card

An apparatus and a method are disclosed herein. The apparatus is disclosed that includes a probe head and a circuit board. The probe head includes a metal housing and pins. The pins penetrate through the metal housing. The circuit board is configured to test a semiconductor device and includes a ground pad. The ground pad is electrically coupled between the metal housing and the circuit board.

A probe head includes a first substrate, a second substrate, a spacer, at least one probe, and an insulating material. The first substrate has at least one first through hole. The second substrate has at least one second through hole. The spacer is disposed between the first substrate and the second substrate. The spacer, the first substrate, and the second substrate together form a cavity. The probe is disposed in the cavity and protrudes from the first through hole and the second through hole. The insulating material is on the probe and at least partially disposed in the first through hole.

Probe head, probe card assembly using the same, and manufacturing method thereof

A printed circuit board (PCB) is disclosed. The PCB includes a plurality of first signal pads, a plurality of signal channels, and a plurality of second signal pads. The first signal pads are adjacently disposed to define an opening. At least one of the first signal pads is configured to be electrically connected to at least one of signal traces of a membrane core inserted into the opening. All of the signal channels are electrically connected to all of the first signal pads respectively. All of the second signal pads are electrically connected to all of the signal channels respectively.

Universal probe card PCB design

A method for assembling a probe card for wafer level testing of a plurality of semiconductor devices simultaneously is disclosed. The probe card may include a circuit board including wafer level testing circuitry, a partially flexible silicon substrate, a plurality of test probes disposed at least partially in the substrate for engaging a plurality of corresponding electrical contacts in a wafer under test, and a compressible underfill coupling the substrate to the circuit board. The method includes aligning and assembling the foregoing components, and curing the underfill. The probe card may be used for wafer level burn-in testing. In some embodiments, the probe card may include active test control circuitry embedded in the silicon substrate for conducting wafer level high frequency testing.

Method for assembling a wafer level test probe card

A probe card for wafer level testing of a plurality of semiconductor devices simultaneously. The probe card may include a circuit board including wafer level testing circuitry, a partially flexible silicon substrate, a plurality of test probes disposed at least partially in the substrate for engaging a plurality of corresponding electrical contacts in a wafer under test, and a compressible underfill coupling the substrate to the circuit board. The probe card may be used for wafer level burn-in testing. In some embodiments, the probe card may include active test control circuitry embedded in the silicon substrate for conducting wafer level high frequency testing.

Growing community of inventors

Hsinchu, Taiwan

Ming-Cheng Hsu