Universal Scientific Industrial Co., Ltd.

Universal Scientific Industrial (shanghai) Co., Ltd.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Universal Global Scientific Industrial Co., Ltd.

Acas Design Co., Ltd.

Global Unichip Corporation

Neostones Micro Fabrication Corporation

Cheng-taung Wang

Ming-Che Wu

Yu-Ru Chang

Chung-Kai Wang

Hung-Chang Hsieh

Yao-Ching Ku

Wen-Hsiung Yu

Mao-Jen Wu

Grace H Ho

Li-Heng Chou

Jung Ting Chen

Hsiu-Luan Chang

Ren-Bao Liaw

A device includes a spacer, which includes a recess extending from a top surface of the spacer into the spacer, and a conductive feature including a first portion and a second portion continuously connected to the first portion. The first portion extends into the recess. The second portion is on the top surface of the spacer. A die is attached to the spacer, and a lower portion of the first die extends into the recess.

Functional spacer for SIP and methods for forming the same

A chip level EMI shielding structure and manufacture method thereof are provided. The chip level EMI shielding structure includes a semiconductor substrate, at least one ground conductor line, a ground layer, and a connection structure. The ground conductor line is disposed on a first surface of the semiconductor substrate, and the ground layer is disposed on a second surface of the semiconductor substrate. The connection structure is formed on a lateral wall of the semiconductor substrate for connecting the ground conductor lines with the ground layer to form a shielding. With such arrangement, the chip level EMI shielding structure can reduce the chip size and the manufacturing cost.

Chip level EMI shielding structure and manufacture method thereof

An electromagnetic interference (EMI) shielding structure, which includes: a substrate, at least one chip unit, a packing layer, and an EMI shielding unit. The chip unit is disposed on the surface of the substrate and electrically coupled thereto. The packing layer is formed on the substrate and covers the chip unit. The EMI shielding unit includes: a first, second, and third shielding layer. The first shielding layer covers the outer surface of the packing layer and the lateral surface of the substrate. The second and third shielding layer respectively covers the outer surface of the first and second shielding layer. Based on the instant disclosure, the EMI shielding unit uses the methods of sputtering and electroless plating, to increase the adhesion strength of the EMI shielding unit and make the thickness of the shielding layer uniform. The instant disclosure raises the EMI shielding efficiency and lowers the manufacturing cost.

Method of manufacturing an electromagnetic shielding structure

A chip stacked structure and method of fabricating the same are provided. The chip stacked structure includes a first chip and a second chip stacked on the first chip. The first chip has a plurality of metal pads disposed on an upper surface thereof and grooves disposed on a side surface thereof. The metal pads are correspondingly connected to upper openings of the grooves. The second chip has a plurality of grooves on a side surface of the second chip, locations of which are corresponding to that of the grooves on the side surface of the first chip. Conductive films are formed on the grooves of the first chip and the second chip and the metal pads to electronically connect the first chip and second chip. The chip stacked structure may simplify the process and improve the process yield rate.

Chip stacked structure and method of fabricating the same

A multi-wavelength light-emitting module that includes a PCB, a drive IC structure, a conductive structure, a multi-wavelength LED array set, a plurality of conductive elements, and an optical amplifier structure. The PCB has at least one input/output pad. The drive IC structure is disposed on the PCB and having at least one concave groove formed on top surface thereof. The conductive structure is electrically connected between the drive IC structure and the at least one input/output pad. The multi-wavelength LED array set is received in the at least one concave groove. The conductive elements are electrically connected between drive IC structure and the multi-wavelength LED array set, respectively. The optical amplifier structure is disposed over the multi-wavelength LED array set for receiving light sources from the multi-wavelength LED array set.

Multi-wavelength light-emitting module

An embedded package structure module with high-density electrical connections, including: a drive IC structure, an LED array structure and a plurality of conductive structures. The drive IC structure has at least one concave groove. The LED array structure is received in the at least one concave groove of the drive IC structure, and the LED array structure has a plurality of second open grooves formed on its lateral wall and close to the drive IC structure. The conductive structures respectively traverse the second open grooves in order to make the conductive structures electrically connect between the drive IC structure and the LED array structure.

Embedded package structure module with high-density electrical connections and method for making the same

A multi-wavelength light-emitting module with high density electrical connections includes a drive IC structure and a multi-wavelength LED array structure. The drive IC structure has a drive IC unit formed on a top surface thereof. The multi-wavelength LED array structure is disposed on the top surface of the drive IC structure, and the multi-wavelength LED array structure has a conductive trace unit formed on an outer surface thereof and electrically connected to the drive IC unit.

Multi-wavelength light-emitting module with high density electrical connections

A method for packaging a multi-wavelength LED array package module includes: forming at least one concave groove on a drive IC structure; arranging a multi-wavelength LED array set in the at least one concave groove; solidifying a plurality of liquid conductive materials to form a plurality of conductive elements that is electrically connected between the drive IC structure and the multi-wavelength LED array set by a printing, a coating, a stamping, or a stencil printing process; arranging the drive IC structure on a PCB with at least one input/output pad; and then forming a conductive structure that is electrically connected between the drive IC structure and the at least one input/output pad.

Multi-wavelength LED array package module and method for packaging the same

A method for arranging print head chips, includes: (a) setting a first fiducial mark and a second fiducial mark on a PCB for determining coordinate positions of a plurality of array units that are arranged on the PCB and calculating a print range of the array units, wherein each array unit has a plurality of spots that are transversely arranged from the first one of the spots to the last one of the spots in sequence; (b) setting a third fiducial mark as a start point for arranging the first spot of a first array unit of the array units on the PCB; and (c) arranging other array units on the PCB in sequence according to the coordinate positions and the start point.

Method for arranging print head chips

An optical alignment method is for a light-emitting module that includes a housing unit, a light-emitting unit disposed in the housing unit, and a lens unit. The optical alignment method includes: (a) through image-capturing techniques, finding a light-emitting point of the light-emitting unit and a predetermined reference point, and determining a total optical path length between the light-emitting point and an imaging plane; (b) finding a first center line that divides the total optical path length in half; (c) through image-capturing techniques, finding opposite first and second edges of the lens unit, and determining a lens length between the first and second edges; (d) finding a second center line that divides the lens length in half; and (e) assembling the lens unit to the housing unit so that the first and second center lines overlap. A light-emitting module and an assembly method therefor are also disclosed.

Light-emitting module and methods for optically aligning and assembling the same

An optical alignment method is for an optical module including a housing unit, a light-sensing unit, and a lens unit. The method includes: (a) through image-capturing techniques, finding a light-sensing component of the light-sensing unit and a predetermined reference point, and determining an actual total optical path length between the light-sensing component and an object position; (b) subtracting a correction distance from the actual total optical path length to obtain a corrected total optical path length; (c) finding a first center line that divides the corrected total optical path length in half; (d) through image-capturing techniques, finding opposite first and second edges of the lens unit, and determining a lens length between the first and second edges; (e) finding a second center line that divides the lens length in half; and (f) assembling the lens unit to the housing unit such that the first and second center lines overlap.

Optical module and methods for optically aligning and assembling the same

A semiconductor wafer is disclosed that includes a plurality of fields, including a plurality of alignment fields. Each alignment field includes a plurality of intra-field small scribe lane primary mark (SSPM) overlay mark pairs there around. The SSPM mark pairs allow for in-situ, non-passive intra-field alignment correction. In one embodiment, there may be between two and four alignment fields, and between two and four SSPM mark pairs around each alignment field. The SSPM marks of each mark pair may be extra scribe-lane marks.

In-situ overlay alignment

The light emitting module includes a substrate, a light emitting element and a driving circuit chip. The light emitting element is attached to the substrate and has a plurality of first contacts on a top surface thereof. The driving circuit chip is attached onto the substrate and has a plurality of second contacts in direct connection to the first contacts one on one when being placed above the light emitting element.

Light emitting module

A method for rapidly identifying porcine estrogen receptor (ESR) marker comprises using published primers to amplify the target DNA fragment by polymerase chain reaction (PCR). The DNA fragment is cloned and then sequenced. The key positions of the sequence are modified to generate three primers which are used to amplify different DNA fragments with different genotypes by PCR to eliminate extra restriction cut reaction. A long one of the primers is to specifically amplify non-prolific allele, a short one of the primers is to specifically amplify prolific allele, and the remaining one is mutual and complimentary to the sequence. After PCR and electrophoresis, the sample with 90 bp band is identified as prolific genotype, the sample with 110 bp band is identified as non-prolific genotype, and the sample with 90 bp and 110 bp bands is identified as hetero-genotype.

Growing community of inventors

Chia-Yi, Taiwan

Ming-Che Wu