Echem Solutions Corp.

Ming Che Chung

Tz Jin Yang

Che Wei Chang

The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator.  In the formulas (1) and (2), n is an integer of 10 to 600, Aris a tetravalent organic group; Aris a divalent to tetravalent organic group; Aris a divalent aromatic group; and Ris an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.

Photosensitive polyimide composition and photoresist film made thereof

The present invention provides a photosensitive insulated resin composition and method of producing an insulated film thereof. The photosensitive insulated resin composition, which comprises the following components, can be evenly coated on a surface step of a substrate in order to form a fully covered insulate film. an alkali soluble resin containing a phenolic group; a quinone diazide-group-containing compound; a crosslinking agent; a high-boiling-point solvent having a boiling point of over or equal to 130&#xb0; C.; and a low-boiling-point solvent having a boiling point of equal to or lower than 130&#xb0; C., wherein a difference of the boiling points of the two high-boiling-point solvent and the low-boiling-point solvent is in a range of 30&#xb0; C.&#x2dc;100&#xb0; C., and a ratio of the high-boiling-point solvent to the low-boiling-point solvent in weight is in a range of 8:92&#x2dc;40:60.

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Taoyuan, Taiwan

Ming Che Chung