Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Other

Mineo Kawamoto

Kanji Murakami

Motoyo Wajima

Haruo Akahoshi

Akio Takahashi

Toyofusa Yoshimura

Hirosada Morishita

Tokihito Suwa

Masashi Miyazaki

Shoji Kawakubo

Masao Suzuki

Satoru Amou

Toshiaki Ishimaru

Shiro Kobayashi

Mitsuo Yokota

Masanori Nemoto

Ritsuji Toba

Hiroyuki Fukai

Yoichi Matsuda

Akio Tadokoro

Haruo Suzuki

Yutaka Itoh

Youichi Matsuda

Makoto Matsunaga

Akio Mukoh

Yuichi Satsu

Nobuyuki Hayashi

Toshikazu Narahara

Takeshi Nojiri

Junichi Katagiri

Shinji Tsuchikawa

Yoshinori Kawai

Akio Nakano

Tomio Yoshida

Atsushi Mori

Rituji Toba

Toshiyuki Chida

Iwao Kaminaga

Kazuo Tanje

Kanzi Murakami

Fumihiko Ohta

Kyoji Kawakubo

Minoru Kanechiku

Akio Takokoro

Hideo Tsuda

Kiyoshi Ozaki

Masatoshi Narahara

A multilayer circuit board having a resolution in the range of 25-80 &mgr;m, and blind via-holes between layers, the blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer having the blind via-holes between the layers has a glass transition temperature in the range of 150-220&deg; C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process are reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes are suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.

Multilayer circuit board having insulating layer with via-holes

Photosensitive resin composition, and multilayer printed circuit board using the same

A multilayer circuit board having a resolution in the range of 25-80 .mu.m, and blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer between said layers having the blind via-holes has a glass transition temperature in the range of 150-220.degree. C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process was reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes were suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.

Multilayer circuit board and photosensitive resin composition used

A photosensitive resin composition for use in manufacture of multi-layer circuit boards with connecting holes between layers is disclosed. The resin composition has excellent adhesion with a plating metal, resolution, photo-curing, thermosetting, thermal resistance, and is capable of being developed using an alkaline solution or an aqueous solution containing a non-halogen based organic solvent as the developing solution. The resin composition comprises a photosensitive epoxy resin, a thermosetting epoxy resin, a reactant of a carboxylic acid added to an acrylonitrile-butadiene rubber and an epoxy resin, a photo-polymerization initiator and a thermosetting agent. This reactant facilitates a high density pattern of connecting holes for circuit boards of the layered type.

Photosensitive resin composition and method for using the same in

A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1); ##STR1## where, R.sub.1 is H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R.sub.2 is an alkylene group having 1-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2); ##STR2## where, R.sub.3 is H or an alkyl group having 1-6 carbon atoms, X is NH or S, and Z is N or C--Y, where Y is H, NH.sub.2, or SH.

Method for manufacturing printed circuit board

Disclosed is a process for preparing a printed circuit board, which comprises the steps of: (1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of Components (a) and (b); (2) forming a negative pattern of the light-sensitive resin composition on the surface of the substrate by irradiating active light imagewisely and developing with a semi-aqueous developing solution; and (3) forming a circuit pattern by electroless copper plating by using the negative pattern of the light-sensitive resin composition on the surface of the substrate as a plating resist.

Process for preparing printed circuit board

Adhesive agent for substrate of electroless plating characterized in comprising epoxy resin, synthetic rubber, and phenolic resin as main components, a hardener of the epoxy resin, inorganic filler having hydroxyl group, and solvent. The adhesive agent is hardened at relatively low temperature (about 150.degree. C.) in short period (within 30 minutes) without giving warp and distortion to the insulation substrate, and moreover its insulation resistance after hardening is high. The adhesive agent is preferable as an adhesive agent for a printed circuit board.

Adhesive agent for substrate of electroless plating, printed circuit

In conducting wiring by masking the portion other than the portion to be wired of a metallic laminate with a photoresist for plating and subjecting only the portion to be wired to pattern plating, the provision of a noble metal layer made of gold, platinum or the like, or a metallic layer made of a metal having a larger ionization tendency than that of a metal used in the pattern plating on the metallic layer constituting the undercoat of the photoresist for plating enables the peeling of the resist for plating to be prevented and excellent fine wiring to be conducted.

Method for improving adhesion of a resist layer to a metallic layer and

The present invention provide a process for producing printed circuit boards which comprises the steps of

Process for producing printed circuit board

A process for producing a printed circuit board, which comprises the steps of forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist on the areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said resist. According to this invention, it is possible to provide a printed circuit board of higher reliability compared with conventional processes.

An electroless copper plating process for producing fine patterned wiring boards is improved by supplying very fine oxygen-containing gas bubbles through a porous alkali-resistant resin gas dispersing tube. An electroless copper plating apparatus having such a gas dispersing tube is also provided.

Process for electroless copper plating and apparatus used therefor

A photo-curable resist resin composition for electroless plating comprising an epoxy resin having a viscosity of at least 150 poises at 25.degree. C., and at least two glycidyl ether groups in one molecule, the glycidyl ether groups being directly bonded to the aromatic ring as Component A, an oxirane ring-containing compound having a boiling point of at least 140.degree. C. and a molecular weight of not more than 500 as Component B, and a photo-sensitive aromatic onium salt as Component C, wherein the Component A is in an amount of 90 to 40 parts by weight per total 100 parts by weight of the Components A and B, and the Component C is in an amount of 0.1 to 5 parts by weight per total 100 parts by weight of the Components A and B, and, if any, other resin components, can produce a resist film capable of withstanding highly alkaline electroless copper plating solution at a high temperature for a long time without any decrease in the physical properties of plating films deposited even by repeated use of the electroless copper plating solution. The resist film prepared from the resist resin composition has distinguished soldering heat resistance, solvent resistance and electrical insulation.

Photo-curable resist resin composition for electroless plating, process

In a process for electroless copper plating in an electroless copper plating solution containing a copper salt, a complexing agent for the copper salt, a reducing agent for the copper salt, and a pH-adjusting agent, a plating film having distinguished mechanical properties can be obtained by adding at least one of soluble inorganic silicon compounds and soluble inorganic germanium compounds and conducting the electroless copper plating by injecting an oxygen-containing gas into the plating solution or by adding an oxidizing agent to the plating solution or by both injection or the oxygen-containing gas and addition of the oxidizing agent thereto. The stability of the electroless copper plating solution can be maintained better thereby and substantially thick plating is possible.

Process for electroless copper plating

A printed circuit board comprising an insulating board deposited with a catalyst having reactivity against electroless plating deposition, a resist for electroless plating provided on the insulating board excepting the part where a circuit is to be formed and a circuit formed by electroless plating, wherein the resist for electroless plating contains a coupling agent having a function of preventing the catalyst from ionizing. A process for producing the printed circuit board in which the insulating board surface excepting the part where a circuit is to be formed is covered with a resist for electroless plating containing a coupling agent having a function of preventing the catalyst from ionizing. Use of said resist for electroless plating can prevent drop of insulation resistance of the insulating board after moisture absorption.

Printed circuit board, process for preparing the same and resist ink

This invention concerns a method for the manufacture of a printed wiring board which particularly proves useful as a printed coil. This method is characterized by the fact that in the work in process which has undergone the step for formation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon. Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.

Method for manufacture of printed wiring board

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Hitachi, Japan

Mineo Kawamoto