Seiko Epson Corporation

Minehiro Imamura

Yasuhide Matsuo

Kenji Otsuka

Kei Tadachi

Hiroyuki Tsuchiya

Tomohiro Hayashi

Kunihiko Takagi

Akira Egawa

Kazuhiro Gomi

Keiko Kumagai

A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

Joining method, apparatus of manufacturing joined body, joined body, ink jet head unit, and ink jet type recording apparatus

A method includes: preparing a transfer base material to have repellency against a silicone material- and conductive particle-containing liquid material; applying the liquid material to a transfer base material surface to form a liquid coating, and drying the liquid coating to obtain a bonding film; imparting energy to the bonding film to develop adhesion near a surface thereof, bonding the transfer base material to a first base material, and then separating the transfer and first base materials to transfer the bonding film to the first base material; thereafter imparting energy to the bonding film to develop adhesion near another surface of the bonding film, and bonding the first base material to a second base material to obtain a temporarily bonded structure; and applying pressure to the temporarily bonded structure to finalize the bonding and electrically connect a first terminal and a second terminal via the conductive particles.

Bonding method and bonded structure

A light source device includes a light source section for supplying a laser beam, a wavelength conversion element for converting a wavelength of the laser beam from the light source section, a temperature measuring section for measuring temperature, a temperature adjusting section for adjusting the temperature of the wavelength conversion element in accordance with a result of the measurement by the temperature measuring section, and a thermal diffusion section for diffusing heat to be conducted to the wavelength conversion element, wherein the thermal diffusion section is provided with a first surface disposed on a side of the wavelength conversion element and a second surface disposed on an opposite side to the first surface, and the temperature measuring section is provided to a part of the thermal diffusion section, which is located on a side of the second surface and has higher thermal conductivity of the thermal diffusion section between the side of the first surface and the side of the second surface than the other part of the thermal diffusion section.

Light source device, lighting device, monitor device, and projector

A laser source device provided with a light source, a wavelength conversion element, an external resonator, and an optical path conversion element. The wavelength conversion element is disposed inside the resonance structure, the second laser beam is taken out on the second optical path by the optical path conversion element and is led to a direction substantially the same as the proceeding direction of the first laser beam, and is used with the first laser beam as the output light beam. The selectively reflective film and the reflective surface for taking out the second laser beam are integrated.

Growing community of inventors

Suwa, Japan

Minehiro Imamura