Lucent Technologies Inc.

Shipley Company LLC

At&t Bell Laboratories

Agere Systems Inc.

Agere Systems Guardian Corp.

Agere Systems Optoelectronics Guardian Corp.

Other

At+t Corp.

Triquint Technology Holding Co.

Samsung Electronics Co., Ltd.

American Telephone & Telegraph Co., At&t Bell Laboratories

Rohm & Haas Electronic Materials LLC

American Telephone and Telegraph, Co.

Shipley&plusmn;company, L.l.c.

Mindaugas Fernand Dautartas

Dan A Steinberg

David W Sherrer

Joseph Michael Freund

George John Przybylek

John William Osenbach

Dennis Mark Romero

Hui Luo

Yiu-Huen Wong

John M Geary

Casimir R Nijander

Michael F Brady

James F Dormer

Edward A Pitman

Dennis Stefanik

Donald E Leber

Sailesh Mansinh Merchant

Carl Edward Gaebe

Richard Bendicks Bylsma

Rudolf Feodor Kazarinov

Martin G Meder

Gleb E Shtengel

Albert M Benzoni

Ofer Sneh

Neal Ricks

Jasean Rasnake

William Stacy

Julie Sheridan-Eng

Greg E Blonder

Richard Joseph Pimpinella

Yinon Degani

King Lien Tai

John J Fisher

Timothy Butrie

Abdallah Ougazzaden

William Michael MacDonald

Lalita Manchanda

Frank Stephen Walters

David Andrew Ramsey

Yuliya Anatolyevna Akulova

Dominic Paul Rinaudo

Kenneth Gerard Glogovsky

William Andrew Gault

Robert B Comizzoli

Jose A Lourenco

Richard T Kraetsch

Edward P Martin, Jr

Steven David Robinson

Arden Jeantilus

Justin Larry Peticolas

Shaun P Scrak

Lisa Ann Peterson

Neil Ricks

Alain S Harrus

Aaron Eugene Bond

Marlin Wilbert Focht

Albert Michael Benzoni

Yang Choong Chen

George J Pryzbylek

Felix Anigbo

Bo A M Andersen

Fred A Stevie

An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.

Optical device package

An apparatus for passively aligning first and second substrates having micro-components disposed thereon when the substrates do not include patterned surfaces which face each other. The apparatus includes a first depression which cooperates with an alignment sphere to mechanically engage a corresponding depression disposed on the front surface of the first substrate and a second depression which cooperates with a second alignment sphere to mechanically engage a corresponding depression disposed on the front surface of the second substrate. The first and second depression of the alignment apparatus and the alignment spheres cooperate to passively align micro-components disposed on each of the substrates.

Alignment apparatus and method for aligning stacked devices

A method of fabricating optical filter is disclosed. The method includes providing the substrate and selectively etching the substrate to form a plurality of freestanding layers. A plurality of dielectric layers is disposed over an outer surface of each of the freestanding layers. The resultant optical filters may be used in a variety of applications including etalon applications.

Method of fabricating optical filters

An optical device is disclosed which includes a single-mode waveguide () which supports a first optical mode in a first region and a second optical mode in a second region. The waveguide includes a guiding layer () having at least one wing () extended outwardly from the guiding layer (). The guiding layer (703) may desirably have a rib waveguide () cross sectional shape at the wings. The wings () decrease in width along the length of the guiding layer to convert a rib waveguide mode at the wings to a channel waveguide mode.

Optical waveguide termination with vertical and horizontal mode shaping

The present invention provides a method for forming a vertical taper in a waveguide. In the present invention, a shadow mask is disposed above a waveguide requiring a vertical taper. Then, the waveguide is exposed to a directional etching process (e.g. deep reactive ion etching) while the mask is moved. Ask the mask moves, different regions of the waveguide will be etched different depths, resulting in a vertical taper in the waveguide.

Method for making optical devices with a moving mask and optical devices made thereby

In accordance with the present invention a fiber optic array is provided. The array includes a substrate having a fiber support surface. The array further includes an optical fiber having a fiber portion that includes an un-jacketed, un-buffered optical core segment. The un-jacketed, un-buffered optical core segment is placed in contact with the fiber support surface to orient the optical core segment at a selected position relative to the support surface. In addition, the array includes a solder glass chemically bonded to the optical core segment and the fiber support surface so that the optical core segment is secured at a predetermined location relative to the support surface of the substrate. A method for fabricating such a fiber optic array is also provided.

Glass bonded fiber array and method for the fabrication thereof

A variable width waveguide useful for mode matching between dissimilar optical waveguides and optical fibers and a method for making the same is described. In one embodiment, a tapered waveguide is etched in a substrate, a cladding material is laid over the upper surface of the substrate and within the waveguide, and the waveguide is then filled with a core material. The core material may be deposited in a single step, or in successive deposition steps.

Variable width waveguide for mode-matching and method for making

A first waveguide holding member has a first transverse surface region and a first optical waveguide having an end terminating at the first transverse surface region. A second waveguide holding member has a second transverse surface region which confronts the first transverse surface region of the first waveguide holding member and a second optical waveguide having an end terminating at the second transverse surface region. A guide member is operatively coupled to the first and second waveguide holding members and guides the first waveguide holding member in a transverse direction relative to the second waveguide holding member so as to selectively optically couple and decouple the ends of the first and second optical waveguides.

Optical waveguide devices and methods of fabricating the same

An optical device is disclosed which includes a waveguide that support a first optical mode in a first region and a second optical mode in a second region. The waveguide further includes single material guiding layer having a lower portion with a first taper and an upper portion with a second taper.

A device including a first solder pad and a second solder pad comprised of a post-soldering alloy composition on a substrate is provided. The alloy composition comprises two or more elements, and the post soldering alloy composition of the first solder pad has different amounts of the two or more elements than the alloy composition of the second solder pad. A method of making a solder pad comprises masking a substrate comprising at least a first solder pad and a second solder pad, wherein the mask exposes a greater area of the first solder pad so that the deposited element becomes part of an alloy composition of the first solder pad upon soldering thereby changing the melting point of the first solder pad.

Solder pads and method of making a solder pad

An optoelectronic submount for providing optical connection and electrical connection to a vertically communicating optical device, such as a vertical cavity surface-emitting laser. The submount has a trench for holding the optoelectronic device on-edge, and electrical connection pits adjoining the trench. A metallization layer is disposed in the electrical connection pits. The electrical connection pits are aligned with the trench and optoelectronic device so that compact pads on the optoelectronic device can be soldered to the metallization layer. A groove can be provided in the submount for holding an optical fiber in alignment with an active area of the optoelectronic device.

Optoelectronic submount having an on-edge optoelectronic device

An optical fiber having an a core with a D-shape or an oval shape at an endface. The optical fiber tapers from a round, cylindrical section to the endface so that adiabatic mode transformation is provided. Preferably, the D-shape or oval shape is selected so that the optical fiber has a mode shape at its endface that matches the mode shape of a diffused waveguide.

Tapered optical fiber for coupling to diffused optical waveguides

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Blacksburg, VA, United States of America

Mindaugas Fernand Dautartas