Altera Corporation

Minchang Liang

Peter John McElheny

Raminda U Madurawe

Richard G Smolen

Yowjuang William Liu

Yow-Juang W Liu

Dirk Alan Reese

Yow-Juang Bill Liu

Fangyun Richter

John E Turner

Myron Wai Wong

James D Sansbury

John C Costello

An integrated circuit (IC) includes one or more silicon-on-insulator (SOI) transistors. Each SOI transistor includes a first source region, a second source region, a drain region, a body contact region, a gate, and first and second isolation regions. The body contact region couples electrically to a body of the SOI transistor. The gate controls current flow between the first and second source regions and a drain region of the transistor. The first isolation region is disposed between the first source region and the body contact region. The second isolation region is disposed between the second source region and the body contact region.

Apparatus and methods for integrated circuit with devices with body contact and devices with electrostatic discharge protection

An integrated circuit (IC) includes mechanisms for adjusting or setting the gate bias of one gate of one or more multi-gate transistors. The IC includes a gate bias generator. The gate bias generator is configured to set gate bias of one gate of the one or more multi-gate transistors within the IC. More specifically, the gate bias generator sets the gate bias of the transistor(s) so as to trade off performance and power consumption of the transistor(s).

Apparatus and methods for multi-gate silicon-on-insulator transistors

An integrated circuit (IC) includes mechanisms for adjusting or setting the gate bias of one gate of one or more multi-gate transistors. The IC includes a gate bias generator. The gate bias generator is configured to set a gate bias of one gate of the one or more multi-gate transistors within the IC. More specifically, the gate bias generator sets the gate bias of the transistor(s) so as to trade off performance and power consumption of the transistor(s).

Complementary metal-oxide-semiconductor (CMOS) integrated circuits with bipolar transistors and methods for fabrication are provided. A bipolar transistor may have a lightly-doped base region. To reduce the resistance associated with making electrical contact to the lightly-doped base region, a low-resistance current path into the base region may be provided. The low-resistance current path may be provided by a base conductor formed from heavily-doped epitaxial crystalline semiconductor. Metal-oxide-semiconductor (MOS) transistors with narrow gates may be formed on the same substrate as bipolar transistors. The MOS gates may be formed using a self-aligned process in which a patterned gate conductor layer serves as both an implantation mask and as a gate conductor. A base masking layer that is separate from the patterned gate conductor layer may be used as an implantation mask for defining the lightly-doped base region.

Bipolar transistors with low base resistance for CMOS integrated circuits

The present invention is a method and apparatus whereby two NMOS or PMOS devices connected in series in a stacked gate configuration formed on SOI exhibit improved ESD response characteristics. The shared source-drain region between the two devices is formed to have a dopant depth in the shared region that does not extend through the silicon layer to the BOX layer. This provides a common body for the two devices, and thus a single parasitic bipolar transistor is formed between the drain of one NMOS or PMOS device and the source of the second NMOS or PMOS device. Simultaneous snapback occurs for the two devices through the common body. A further embodiment includes a method of forming two or more stacked gate NMOS or PMOS devices on SOI. The method includes protecting the shared source-drain region between two NMOS or PMOS devices during a final doping step and silicide processing.

Method for implementing electro-static discharge protection in silicon-on-insulator devices

The present invention is a method and apparatus whereby two NMOS or PMOS devices connected in a stacked gate configuration formed on SOI exhibit improved ESD response characteristics. The shared source-drain region between the two devices is formed to have a dopant depth in the shared region that does not extend through the silicon layer to the BOX layer. This provides a common body for the two devices, and thus a single parasitic bipolar transistor is formed between the drain of one NMOS or PMOS device and the source of the second NMOS or PMOS device. Simultaneous snapback occurs for the two devices through the common body. A further embodiment includes a method of forming two or more stacked gate NMOS or PMOS devices on SOI. The method includes protecting the shared source-drain region between two NMOS or PMOS devices during a final doping step and silicide processing.

Provided is a &ldquo;castled&rdquo; active area mask. A castled active area mask is one which has been lengthened to extend beyond its intended intersection with a tunnel dielectric to form the tunnel window of an EEPROM cell, and has also been widened in at least a portion of the extension. For example, in one preferred embodiment, a castled extension may have a &ldquo;T&rdquo; shape. The castled active area generated by such a mask provides a buffer to absorb field oxide encroachment before it reaches the EEPROM cell's TD window. A mask in accordance with the present invention may be used to fabricate EEPROM cells which are not subject to TD window size variations due to field oxide encroachment, and EEPROM cell arrays of increased density.

EEPROM active area castling

Castled active area mask

Process for making an EEPROM active area castling

Disclosed is a method for biasing dual row line EEPROM cells. The new biasing scheme improves the data retention lifetime of an EEPROM cell by reducing the potential difference between the control gate and the write column of the cell, which reduces the tunnel oxide electric field. In a preferred embodiment, the method involves applying bias voltages to the control gate and write column of an EEPROM cell such that the potential difference between the control gate and the right column is no more than about 0.5 volts. By biasing the cell's write column to a positive voltage, the tunnel oxide field may be significantly reduced. Moreover, the invention provides a method of selecting a write column voltage based on a control gate voltage such that the tunnel oxide field is substantially balanced in all its modes. This biasing scheme minimizes SILC and improves cell reliability.

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Santa Clara, CA, United States of America

Minchang Liang