Hitachi Astemo Ltd.

Minami Teranishi

Hideyuki Sakamoto

Shinya Kawakita

Michihito Watarai

Miki Hiraoka

Hidetatsu Yamamoto

Eiji Ichikawa

Daisuke Tanaka

Ryujo Sugahara

An electronic control device includes a housing including a first region in which heat dissipation fins are formed on one side and an electronic component generating the largest amount of heat is in thermal contact with the other side, and a second region in which an electronic component is in thermal contact with the one side and the other side.

Electronic control device

An electronic control device includes a first circuit board having a first mounting surface on which a first electronic component is mounted, a second circuit board having a second mounting surface on which a second electronic component is mounted, and a base member disposed between the first mounting surface and the second mounting surface so as to face the first electronic component and the second electronic component, where a first heat-conducting material is disposed between the base member and the first electronic component, a second heat-conducting material is disposed between the base member and the second electronic component, the base member includes a first region that at least does not overlap the second circuit board when viewed in a line-of-sight direction normal to the first mounting surface and the second mounting surface, and a second region that overlaps both of the first circuit board and the second circuit board when viewed in the line-of-sight direction, a heat dissipation unit including a plurality of heat dissipation fins is provided in the first region of the base member, and a ventilation hole penetrating between the heat dissipation unit and an outside is provided in the second region of the base member.

An electrical device includes a first housing which has therein a first circuit board on which a first electronic component is mounted, a second housing which has therein a second circuit board on which a second electronic component is mounted, and fans which send air passing between the first housing and the second housing. The first housing has a plurality of fins facing the second housing. The second housing has a plurality of fins facing the first housing. In at least one of cross sections of the first circuit board in a thickness direction, the electrical device has a structure having a region in which the fin of the first housing is longer than the fin of the second housing and a region in which the fin of the first housing is shorter than the fin of the second housing.

Electrical device and electronic control device with housings having fin arrangement and fan for air flow

An electronic control device includes a base, a first fan and a second fan provided on one surface, a plurality of first heat-dissipating fins provided on the one surface in a first region including a region between first and second fans such that the plurality of first heat-dissipating fins are provided in the region between the first second fans, and a plurality of second heat-dissipating fins provided on the one surface and in a second region. The plurality of first heat-dissipating fins guide a refrigerant sent by one of the first and second fans toward a remaining one of the first and second fans in the first region, and the plurality of second heat-dissipating fins provided in the second region have a structure for guiding a refrigerant flowing in from the first fan or the second fan away from the first fan and the second fan.

An electronic control device includes an enclosure including a first enclosure having an assembly opening and a second enclosure covering the entire assembly opening, the enclosure having a communication opening communicating with the assembly opening; a circuit board accommodated in the enclosure; an integrated circuit element mounted on the circuit board; and a heat dissipating shield member thermally coupled to the integrated circuit element and grounded, wherein the heat dissipating shield member includes an inner portion accommodated inside the enclosure and thermally coupled to the integrated circuit element and an outer portion extending to an outside of the enclosure via the communication opening.

Provided is an electronic control device including a first electronic component having a first heat generation amount, a second electronic component having a second heat generation amount smaller than the first heat generation amount, a substrate on which the first and second electronic components are mounted, and a housing that accommodates the first electronic component, the second electronic component and the substrate, and includes a case for heat radiation having a heat radiation structure through which heat of the first and second electronic components is radiated. The heat radiation structure includes a heat radiation block that is heat-bonded to the first electronic component, and a plurality of plate-shaped heat radiation fins extending outward from an outer peripheral portion of the heat radiation block.

Growing community of inventors

Tokyo, Japan

Minami Teranishi