Taiyo Yuden Co., Ltd.

Mina Amano

Takahisa Fukuda

Anju Okada

Yasuyuki Inomata

Kiyoshiro Yatagawa

Yasuhisa Kono

A ceramic electronic component includes an element body, a first external electrode, and a second external electrode. The element body includes a dielectric, at least one first internal electrode, and at least one second internal electrode laminated over the first internal electrode via the dielectric interposed therebetween. The element body has a top surface, a bottom surface, a pair of side surfaces, a first end surface, and a second end surface, thereby the element body having a generally cuboid shape. The first internal electrode is exposed on the first end surface. The second internal electrode is exposed on the second end surface. The side surfaces of the element body are concavely curved along a longitudinal direction, so that the element body has a longitudinal central part at which a width is less than a width at the end surface. The first external electrode is formed on the first end surface and electrically connected with the first internal electrode. The second external electrode is formed on the second end surface and electrically connected with the second internal electrode.

Ceramic electronic component, circuit substrate arrangement, and method of manufacturing ceramic electronic component

An electronic component includes an element body and at least one external electrode thereon. The element body has a dielectric and inner electrodes. Each external electrode includes a base layer connected to at least one the inner electrode. The base layer is formed on a plurality of surfaces of the element body and contains a metal and a first co-material mixed with the metal. Each external electrode also includes a plating layer formed on at least one face of the base layer. Each external electrode also includes an oxide layer formed on one or more faces of the base layer other than those faces of the base layer on which the plating layer is formed. The oxide layer has a surface layer made from an oxide film of the metal of the base layer and a second co-material.

Electronic component, circuit board arrangement and method of manufacturing electronic component

A multilayer ceramic capacitor includes: a multilayer structure in which each of a plurality of ceramic dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being alternately exposed to a first edge face and a second edge face of the multilayer structure, wherein 1.5&#x2264;Db/Da&#x2264;10.0 is satisfied in a side margin region that covers edge portions to which the plurality of internal electrode layers extend toward two side faces other than the first edge face and the second edge face, when Da is an average grain diameter of a main component ceramic within 20 &#x3bc;m from an edge of the plurality of internal electrode layers in the side margin region and Db is an average grain diameter of a main component ceramic within 20 &#x3bc;m from a surface layer of the side margin region.

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Tokyo, Japan

Mina Amano