Taiwan Semiconductor Manufacturing Comp. Ltd.

National Taiwan University

Min-Yuan Cheng

Hsi-Kuei Cheng

Hsien-Ping Feng

Steven Lin

Chi-Wen Liu

Huang-Yi Huang

Yuh-Da Fan

Chien-Kuo Chiu

Chieh-Tzu Chou

Jung-Chin Tsao

A retrofitting method for a beam with an opening is disclosed. The retrofitting method provides a hoop cooperated with an inclined stirrup to form a reinforcement set. The hoop is used to enclose the opening; and the reinforcement set may be selectively adjusted according to the distance between the edge of opening and a column face. The retrofitting method and reinforcement set are not only suitable for openings located in the non-plastic hinge zone of the beam, but also suitable for the openings located in the plastic hinge zone.

Retrofitting method for a beam with an opening

A high-tensile belt-type tag including a belt, a high-tensile transmission line, an antenna and a radio frequency identification (RFID) chip is provided, wherein the belt includes a belt body and a retaining ring. The belt body is suitable to slip into an opening of the retaining ring and preventing the belt body from slipping out of the opening. The high-tensile transmission line, the antenna and the RFID chip are disposed in the belt, and the high-tensile transmission line encircles the whole belt in accordance with a shape of the belt. Moreover, the RFID chip is coupled to the antenna through the high-tensile transmission line, wherein when the high-tensile transmission line is split as the belt is cut off, the RFID chip cannot delivers an identification code through the antenna due to split of the high-tensile transmission line.

High-tensile belt-type tag and wireless radio frequency identification system employing the same

A method for monitoring copper film quality and for evaluating the annealing efficiency of a copper annealing process includes measuring hardness of a copper film formed on a substrate before and after annealing and comparing the hardness measurement results. The measurements can be correlated to grain boundary saturation levels, copper grain sizes and therefore conductivity. Hardness measurements may be taken at a plurality of locations throughout the substrate to account for variations in the copper film grain structure.

Method for conductive film quality evaluation

A method of forming a metal layer with reduced defects comprising providing a structure having a dielectric layer formed over it, forming a dielectric layer having an opening, lining the opening with a metal seed layer, treating the metal seed layer with a cleaning process to remove contaminates from it, and forming a metal layer upon the metal seed layer.

Method to eliminate plating copper defect

Growing community of inventors

Taipei, Taiwan

Min-Yuan Cheng