Taiwan Semiconductor Manufacturing Comp. Ltd.

Min-Yu Wu

Wei-Chih Chen

Cheng-Lung Wu

Wen-Ming Chen

Chih-Yuan Chiu

Chi-chun Peng

Tung-Hsiao Yu

Yi-Kai Tu

A die dipping structure includes a plate including a first recessed portion having a first depth and filled with a first flux material. The plate further includes a second recessed portion, isolated from the first recessed portion, with a second depth and filled with a second flux material. The second depth is different from the first depth. The die dipping structure further includes a motor configured to move the plate so as to simultaneously dip a first die and a second die into the flux of the first recessed portion and the flux of the second recessed portion, respectively.

Semiconductor die dipping structure

A method includes setting a first tension value of a laminating tape during a standby mode. A second tension value of the laminating tape is set during taping on a wafer. The second tension value is different from the first tension value. A third tension value of the laminating tape is set after taping. The third tension value is different from the second tension value.

Wafer taping scheme

Growing community of inventors

Hsin-Chu, Taiwan

Min-Yu Wu