Advanced Semiconductor Engineering, Inc.

Min-Yao Cheng

Han-Chee Yen

Ying-Nan Liu

A semiconductor device package is provided. The semiconductor device package includes providing a first substrate, a computing unit and a power module. The first substrate has a first surface and a second surface opposite to the first surface. The computing unit is adjacent to the first surface. The computing unit includes a semiconductor die. The power module is adjacent to the second surface. The power module includes a power element and a passive element. Each of the semiconductor die, the power element, and the passive element is vertically arranged with respect to each other, and the passive elements are assembled between the semiconductor die and the power element.

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Kaohsiung, Taiwan

Min-Yao Cheng