General Electric Company

Sabic Innovative Plastics IP B.v.

Ge Grid Solutions LLC

Boe Technology Group Co., Ltd.

Min Yan

Ahmet Gun Erlat

Anil Raj Duggal

Marc Schaepkens

Tae Won Kim

Christian Maria Anton Heller

Ri-an Zhao

Paul Alan McConnelee

Brian Joseph Scherer

Thomas Bert Gorczyca

Weijun Yin

Jie Jerry Liu

James Edward Pickett

Xiaolei Shi

George Theodore Dalakos

Dennis Joseph Coyle

Stefan Rakuff

Svetlana Rogojevic

Sheila Tandon

Rebecca Suzanne Northey

Ahmet Gün Erlat

Shelia Neumann Tandon

Paul Alan Mcconnelee

Christian Maria Heller

Ri-An Zhao

According to some embodiments, system and method are provided comprising calculating an output power setpoint for a thermal generation system for a first calculation cycle of a time window having at least one calculation cycle; calculating a net demand for dispatchable power to satisfy a required load demand after calculating an available renewable power generation; determining, responsive to determining that the net demand for dispatchable power exceeds the output power setpoint for the thermal generation system, whether a discharge power of an energy storage device satisfies a power gap; generating, responsive to determining that the discharge power is not larger than a power rating, a discharge command to discharge the energy storage device at the discharge power; and increasing, responsive to determining that the discharge of the energy storage device fails to satisfy the power gap, the output power setpoint for the thermal generation system for the first calculation cycle.

Hybrid power generation system with power output smoothing operation

According to some embodiments, system and method are provided comprising determining a maximum storage capacity of an energy storage system for a time window; performing a first sort of cycles by sorting in numerical order according to a ratio of a load demand to a total available power from a power generation system at each cycle of time window; assigning a unique, charge priority to each cycle; determining, starting from a highest charge priority, a charge power for each cycle until a total charge power satisfies the maximum storage capacity; determining, starting from a lowest sorted charge priority, an available discharge power for each cycle until a total discharge power exceeds the maximum storage capacity; performing a second sort in a temporal order of the cycles; determining, starting from an earliest cycle, an available state-of-charge (SOC) and adjusting the SOC of the energy storage system for each cycle.

Battery charge and discharge power control in a power grid

A high-temperature insulation assembly for use in high-temperature electrical machines and a method for forming a high-temperature insulation assembly for insulating conducting material in a high-temperature electrical machine. The assembly includes a polymeric film and at least one ceramic coating disposed on the polymeric film. The polymeric film is disposed over conductive wiring or used as a conductor winding insulator for phase separation and slot liner.

Hybrid dielectric film for high temperature application

A method and system for DC magnetron sputtering deposition of films on plastic substrates. The method includes using a shield to block deposition in a spatial region corresponding to a plasma region formed during magnetron sputtering. An optoelectronic device including an amorphous electrode film is also disclosed.

Optoelectronic devices having electrode films and methods and system for manufacturing the same

A composite article with at least one high integrity protective coating, the high integrity protective coating having at least one planarizing layer and at least one organic-inorganic composition barrier coating layer. A method for depositing a high integrity protective coating.

High integrity protective coatings

A barrier coating for a composite article is provided. The barrier coating includes an organic zone; an inorganic zone; and an interface zone between the organic zone and the inorganic zone.

Barrier coating and method

A method of processing a multilayer film is provided. The method includes providing a substrate film having a substrate film first surface and a substrate film second surface. The method also includes providing a barrier layer adjacent to the substrate film second surface. The barrier layer has at least one opening allowing fluid communication between the substrate film and an outer surface of the barrier layer. Further, the method includes contacting the substrate film first surface with a first reactant and finally contacting the outer surface of the barrier layer with a second reactant, said second reactant being reactive with said first reactant. The method of contacting the substrate film first surface to the first reactant and contacting the outer surface of the barrier layer to the second reactant is carried out under conditions under which reaction between said first reactant and the second reactant results in a formation of a reaction layer.

Method of processing multilayer film

An optoelectronic device assembly can include: a coated element and an electroactive cell on the coated element, wherein the electroactive cell is selected from the group consisting of a light emitting diode and a photovoltaic cell. The coated element can include: transparent thermoplastic substrate and a protective weathering layer. The transparent thermoplastic substrate can include a material selected from the group consisting of aromatic polycarbonate and polyester, and combinations including at least one of the foregoing materials. The protective weathering layer can have a UV absorbance loss rate at 330 nm of less than or equal to 0.15 A/year as estimated from filtered xenon arc exposure and/or having a rate of erosion of less than or equal to 5 &#x3bc;m per year as estimated from filtered xenon arc exposure.

Optoelectronic devices and coatings therefore

Methods for improving coating or etching uniformity of non-conductive substrates in plasma-mediated processes generally include applying an electrically conductive coating to the non-conductive substrate prior to plasma processing. The electrically conductive coating is disposed in electrical communication with a metallic electrode of a plasma reactor. By disposing a conductive layer on the non-conductive substrate, a uniform electric potential is created during plasma processing can be built up on the non-conductive, which is equivalent to that of the metallic electrode upon which it is disposed during plasma processing.

Plasma mediated processing of non-conductive substrates

A device including a layer comprising a light emissive area and a light non-emissive area. A light-extracting feature is disposed over the light non-emissive area. The light-extracting features can include surface aberrations and reflective index matching elements. A method of forming the device is also provided.

Light-emitting device and article

A barrier coating of organic-inorganic composition, the barrier coating having optical properties that are substantially uniform along an axis of light transmission, said axis oriented substantially perpendicular to the surface of the coating.

Barrier coatings

Disclosed is a method relating to graded-composition barrier coatings comprising first and second materials in first and second zones. The compositions of one or both zones vary substantially continuously across a thickness of the zone in order to achieve improved properties such as barrier, flexibility, adhesion, optics, thickness, and tact time. The graded-composition barrier coatings find utility in preventing exposure of devices such as organic electro-luminescent devices (OLEDs) to reactive species found in the environment.

Method for making a graded barrier coating

In a method for depositing a barrier coating, a device is provided comprising a first portion and a second portion where a surface of the second portion is in a shadow zone. The device is pretreated wherein the pretreating alters a deposition rate of the barrier coating on a surface exposed to the pretreating. The shadow zone is substantially unexposed to the pretreating. A barrier coating is deposited wherein the barrier coating substantially conforms to a profile of the device. The coating may be a graded-composition barrier coating wherein a composition of the coating varies substantially continuously across a thickness thereof. The first portion may include a flexible, substantially transparent substrate. The second portion may include an electronic device. The barrier coating and first portion may encapsulate the second portion. The method is a single, commercially advantageous, barrier deposition process, enabling increased product throughput and low process tact time.

System and method for applying a conformal barrier coating with pretreating

Processes for simultaneously encapsulating multiple optoelectronic devices and/or depositing a barrier film onto multiple substrates suitable for fabrication of optoelectronic devices thereon include the use of a plasma deposition apparatus having multiple pairs of opposing electrodes for deposition of reactants onto the substrate that is used to form the device or the complete device itself. The processes significantly reduce tact time relative to one at a time batch processing that is currently used for manufacturing optoelectronic devices.

Growing community of inventors

Ballston Lake, NY, United States of America

Min Yan