Samsung Electronics Co., Ltd.

Min-Woong Choi

Jong-Heui Song

Se-Hyeong Lee

A plasma etching apparatus is provided having a sealing member coupling an upper electrode to the plasma etching chamber. A peripheral portion of the inner surface of the upper electrode includes a planar surface across both anodized and non-anodized portions of the surface in the peripheral contact region adjacent to the upper portion of the sidewalls of the chamber assembly. A sealing member is positioned between the planar, peripheral portion of the second electrode and the upper portion of the sidewalls to provide a seal therebetween. The anodized portion of the inner surface of the upper electrode may extend over the area adjacent to the opening in the chamber housing and further extend into the peripheral portion beyond the sealing member to reduce the potential for arcing to occur to the non-anodized section during plasma etching operations. Plasma etching apparatus according to the present invention may provide improved sealing, thereby allowing improved control of vacuum level and concentration of processing gas within the plasma etching chamber during etching operations.

Growing community of inventors

Seoul, South Korea

Min-Woong Choi