Samsung Electro-mechanics Co., Ltd.

Min Sung Choi

Jae Yeol Choi

Jae Wook Lee

Sung Kwon Oh

Ji Eun Kim

Jin Mo Ahn

Jong Ik Park

A coil electrode component includes a body including magnetic metal material, a coil disposed in the body and having first and second lead parts respectively outwardly exposed through first and second surfaces of the body. A first plating electrode is formed on the first surface of the body and a further surface of the body connected to and extended from the first surface of the body, and connected to the first lead part. A second plating electrode is formed on the second surface of the body and a further surface of the body connected to and extended from the second surface of the body, and connected to the second lead part.

Coil electronic component and method of manufacturing the same

An electronic component includes a magnetic body containing magnetic metal powder; and external electrodes disposed on an outer portion of the magnetic body. The external electrodes include first plating layers in direct contact with the magnetic body.

Electronic component, and method of manufacturing thereof

An electronic component includes a body having a bottom surface provided as a mounting surface, a top surface opposing the bottom surface, first and second side surfaces opposing each other in a width direction, and third and fourth end surfaces opposing each other in a length direction, a conductor part disposed therein, first and second external electrodes spaced apart from each other on the bottom surface of the body and connected to the conductor part, and a first insulating coating layer on the top surface of the body and a second insulating coating layer on the bottom surface of the body.

Electronic component and board having the same

A multilayer ceramic electronic component includes a ceramic body having a stacked plurality of dielectric layers and first and second end portions and a plurality of lateral surfaces. A plurality of internal electrodes stacked in the ceramic body face each other with respective dielectric layers interposed therebetween and exposed to first and second lateral surfaces of the ceramic body opposing each other through respective lead portions thereof. At least two first external electrodes and at least two second external electrodes are provided on the first and second lateral surfaces to be connected to the respective lead portions, respectively. An insulation layer is provided on the first and second lateral surfaces of the ceramic body except for the first and second external electrodes.

Multilayer ceramic electronic component and method of manufacturing the same

A coil component includes a magnetic body including first and second coil patterns respectively disposed on first surfaces of two substrates spaced apart from each other and having cores and third and fourth coil patterns respectively disposed on second surfaces of the two substrates; and first to fourth external electrodes disposed on outer peripheral surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates while being located in at least one of upper and lower regions of the magnetic body in a thickness direction.

Coil component

A chip electronic component may include an insulating layer formed on a lower portion of a side surface of an internal coil pattern to avoid a direct contact between the internal coil pattern and a magnetic material, thereby preventing a waveform distortion indicating a reduction in inductance at high frequency.

Growing community of inventors

Suwon-si, South Korea

Min Sung Choi