Intel Corporation

Other

Min Suet Lim

Eng Huat Goh

Bok Eng Cheah

Jackson Chung Peng Kong

Tin Poay Chuah

Jiun Hann Sir

Khang Choong Yong

Howe Yin Loo

Yew San Lim

Jeff Ku

Boon Ping Koh

Poh Tat Oh

Wil Choon Song

Hoay Tien Teoh

Van H Le

Maruti Gupta Hyde

Chee Chun Yee

Kooi Chi Ooi

Rajashree Raji Baskaran

Chin Lee Kuan

Mooi Ling Chang

Fern Nee Tan

Jia Yan Go

Hebatallah Saadeldeen

Seok Ling Lim

Divya Vijayaraghavan

Denica N Larsen

Lady Nataly Pinilla Pico

Khai Ern See

Twan Sing Loo

Jimmy Huat Since Huang

Shantanu Dattatraya Kulkarni

Tongyan Zhai

Han Kung Chua

Chung Peng Jackson Kong

Shawna M Liff

Feras Eid

Telesphor Kamgaing

Robert L Sankman

Nageen Himayat

Linda L Hurd

David W Browning

Md Altaf Hossain

Jenny Shio Yin Ong

Mark Charles Carbone

Chee How Lim

Juha Paavola

Jaejin Lee

Jianfang Olena Zhu

Shawn McEuen

Jimin Yao

Ping Ping Ooi

Arnab Sen

Mark J Gallina

John Lang

Richard Christopher Stamey

Baomin Liu

Aiswarya M Pious

Jenn Chuan Cheng

Gayathri Jeganmohan

Ankitha Chandran

Xi Guo

Surya Pratap Mishra

Siang Yeong Tan

Chu Aun Lim

Javed Shaikh

Mark Macdonald

Teong Keat Beh

James Panakkal

Deepak Sekar

Say Thong Tony Tan

Khai Ern Ke See

Jon Sern Lim

Wei Cheang Lau

Siew Fong Yap

Cora Nien

Jose Oviedo Salazar

Kyle Davidson

Kevin Byrd

James Wade

Chee Kheong Yoon

Bruce Cheng

Jeffrey Ho

Kavitha Nagarajan

J-Wing Teh

Tai Loong Wong

Eng Huat Eh Goh

Damien Weng Kong Chong

Thermal Management Systems for electronic devices and related methods are disclosed. An example electronic housing includes a housing defining a cavity, electronics in the cavity, and a touch display over the electronics. A heat spreader has a first surface toward the electronics and a second surface opposite the first surface toward the touch display, where the heat spreader is to dissipate heat generated by the electronics. A glass cover is coupled to the housing and has a first side toward the touch display and a second side opposite the first side, where the glass cover is exposed external to the housing. An insulation layer is between the second surface of the heat spreader and the second side of the glass cover to restrict heat transfer from the electronics to the second side of the glass cover.

Thermal management systems for electronic devices and related methods

An electronic package with passive components located between a first substrate and a second substrate. The electronic package can include a first substrate including a device interface for communication with an electronic device. An interposer can be electrically coupled to the first substrate. A second substrate can be offset from the first substrate at a distance. The second substrate can be electrically coupled to the first substrate through the interposer. A passive component can be attached to one of the first substrate or the second substrate. The passive component can be located between the first substrate and the second substrate. A height of the passive component can be is less than the distance between the first substrate and the second substrate. The second substrate can include a die interface configured for communication with a die. The die interface can be communicatively coupled to the passive component.

Electronic package with passive component between substrates

Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.

Thermal solutions for cooling electronic devices

Particular embodiments described herein provide for an electronic device that includes an electronic component, a support structure that includes a radiation source, a radiation shield on the support structure. The radiation shield includes a wall and the wall is not continuous around the radiation source and includes a radiation shield gap, where the electronic component covers the radiation shield gap to complete the radiation shield wall.

Radiation shield with radiation shield gap

There may be provided a fastener arrangement. The fastener arrangement may include a first fastener tape including a first plurality of electrically conductive coupling elements and a first plurality of non-electrically conductive coupling elements. The fastener arrangement may further include a second fastener tape comprising a second plurality of electrically conductive coupling elements and a second plurality of non-electrically conductive coupling element. The fastener arrangement may further include a slider couplable to the first fastener tape and the second fastener tape for reversibly interleaving and interlocking the first plurality of electrically conductive and non-electrically conductive coupling elements with their corresponding second plurality of electrically conductive and non-electrically conductive elements. The interleaved and interlocked first and second plurality of electrically conductive coupling elements may form a plurality of conductive-bridges and the interleaved and interlocked first and second plurality of non-electrically conductive coupling elements may form a plurality of insulation-bridges.

Flexible printed circuit board arrangement

Hinges for electronic devices are disclosed herein. An example hinge includes a bracket capable of being coupled to a first portion of the electrical device. The bracket has a barrel defining a first opening. The hinge also includes a shaft in the first opening. The shaft is rotatable in the first opening. The hinge further includes a sleeve capable of being inserted into a bore in a second portion of the electronic device. The sleeve defines a second opening to receive a portion of the shaft.

Hinges for electronic devices

Systems, apparatus, articles of manufacture, and methods are disclosed for accessories for electronic devices and removable fan cartridges for electronic devices. An example electronic device accessory includes a backplate panel removably couplable to a first chassis of a first electronic device to replace a portion of a first cover of the first chassis and removably couplable to a second chassis of a second electronic device to replace a portion of a second cover of the second chassis. The example electronic device accessory also includes a mating device to releasably couple the backplate panel to the first chassis and independently releasably couple the backplate panel to the second chassis and a fan coupled to the backplate panel. The fan is to increase a Z height of the first electronic device when the backplate panel is coupled to the first electronic device and increase a Z height of the second electronic device when the backplate panel is coupled to the second electronic device.

Removable fan cartridges for electronic devices

In one embodiment, a system includes a first circuit defining recesses along an edge of the first circuit board, and a second circuit board defining fins extending from at least one outer edge of the second circuit board. The fins of the second circuit board are positioned within the recesses of the second circuit board to connect the circuit boards in a co-planar manner. The fins and recesses may be shaped to provide an interlocking connection of the first and second circuit boards in the co-planar direction.

Co-planar interconnection mechanisms for circuit boards

An integrated circuit package may be fabricated by disposing an underfill material between an electronic substrate and an integrated circuit device through an opening in the electronic substrate. In one embodiment, an integrated circuit assembly may include an electronic substrate having a first surface and an opposing second surface, wherein the electronic substrate includes at least one opening extending from the first surface to the second surface. The integrated circuit assembly may further include an integrated circuit device, wherein the integrated circuit device is electrically attached to the electronic substrate with at least one interconnect, and an underfill material may be disposed between the first surface of the electronic substrate and the integrated circuit device, wherein a portion of the underfill material extends into the opening in the electronic substrate.

Through-substrate underfill formation for an integrated circuit assembly

Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber that includes ionized fluid and an adjustable polarization layer coupled to the vapor chamber. The adjustable polarization layer can be used to direct a flow of the ionized fluid in the vapor chamber towards one or more heat sources. In some examples, the ionized fluid is ionized water and the adjustable polarization layer is polyester (PET) film that includes a plurality of electrode stripes.

Vapor chamber with ionized fluid

Particular embodiments described herein provide for an electronic device that can be configured to include a radiation shield that includes a zipper. The radiation shield can include a wall that extends from a support structure of the electronic device, a first portion that is coupled to a cold plate over a radiation source, a second portion that is coupled to the wall, and a zipper that can zip the first portion to the second portion together and can unzip to separate the first portion from the second portion.

Radiation shield with zipper

An illuminated display screen bezel may provide improved user illumination when using a portable electronic device. The illuminated display screen bezel may include a series of LEDs built into the bezel, may include a light guide plate, or may include an extended display area at least partially covered by a controllable opaque layer. These lighting mechanisms may be dynamically controlled and adjusted with one or more smart control algorithms to suit different users. The improved image quality may be used to provide improved performance of image processing features, such as improving the ability of a videoconferencing program to create a virtual background or improving the ability of an AI system to perform image analysis. These lighting configurations may also be used for providing notification lights, automatic dimming based on detected ambient light, program-enhancing RGB lighting effects, mood lighting, and other lighting effects.

Computing device with integrated bezel light

Electronic devices with moveable display screens are described herein. An example electronic device includes a lid having a first display screen and a base. The lid is moveably coupled to the base. The base includes a housing having a top side and a bottom side, a physical keyboard to be accessed on the top side of the housing, and a second display screen moveable between a first position in which the keyboard is exposed and a second position in which the second display screen covers the keyboard.

Electronic devices with moveable display screens

Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.

Electromagnetic interference shielding enclosure with thermal conductivity

Particular embodiments described herein provide for a flexible vapor chamber with shape memory material for an electronic device. In an example, the electronic device can include a flexible vapor chamber and shape memory material coupled to the shape memory material. When the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.

Flexible vapor chamber with shape memory material

Growing community of inventors

Simpang Ampat, Malaysia

Min Suet Lim