Samsung Electronics Co., Ltd.

Min-Soo Yang

Min-gyu Kim

Jeong Bae Lee

Soo Dol Park

Chi Dae Yang

A cooling apparatus includes a compressor; a condenser for condensing a refrigerant discharged from the compressor, an expansion valve to expand the refrigerant discharged from the condenser, and an evaporator to evaporate the refrigerant discharged from the expansion valve and to deliver the refrigerant to the compressor. The compressor includes a rotary compressor having a displacement volume less than about 3 cc, and refrigerant circulating inside the cooling apparatus includes at least one of R290, R600a, R123a, R1234yf, and R1234ze. The cooling apparatus and compressor attain miniaturization and high efficiency.

Cooling apparatus and compressor

A polishing pad conditioner cleaning method and an apparatus for effectively removing particles from a polishing pad conditioner. The polishing pad conditioner is immersed into a cleaning liquid contained in a cleaning bath. The cleaning liquid is continuously supplied into the cleaning bath. An inert gas is injected into the cleaning liquid from a bottom of the cleaning bath. The injected inert gas bubbles the cleaning liquid, so that the particles sticking to the polishing pad conditioner are removed and overflow from the cleaning bath. The polishing pad conditioner is effectively cleaned, so that formation of particles and scratches on a wafer are reduced when a polishing process is subsequently carried out using the cleaned polishing pad conditioner.

Growing community of inventors

Suwon, South Korea

Min-Soo Yang