Alti-electronics Co., Ltd

Seoul National University

Korea University Research and Business Foundation

Alti-electronic Co., Ltd

Min-Sik Kim

Sun-Hong Kim

Ji-Na Lee

Jin-Won Lee

Kyoung-Il Park

Sang-Won Lee

Ki-bum Kim

Seok-Won Hyung

Jin-Na Lee

Hyun-Mi Kim

Ki-Ju Kim

The present invention relates to a method for manufacturing a sample for thin film property measurement and analysis, and a sample manufactured thereby and, more specifically, to: a method for manufacturing a sample capable of measuring or analyzing various properties in one sample; and a sample manufactured thereby.

Method for manufacturing sample for thin film property measurement and analysis, and sample manufactured thereby

A liquid chromatography device includes a sample inlet valve to which a sample to be analyzed is introduced, and a trap valve fluid-communicating with a solid phase extraction column and a reverse phase liquid chromatography column. The device further includes a solvent dividing unit dividing flow of a solvent discharged from the sample inlet valve into the first solvent inlet port and the second solvent inlet port of the trap valve. The liquid chromatography device improves resolution and increases reproducibility by allowing the sample injecting direction and the sample eluting direction to be opposite to each other.

Liquid chromatography device

Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.

Side view light emitting diode package

Disclosed is a light-emitting diode package. The light-emitting diode package includes an electrode pad on which a chip is placed; a housing having a window through which the chip is exposed; a housing wall defining the window; and an electrode lead extended from the electrode pad in a direction of the housing to be exposed outside a surface of the housing, wherein the housing wall formed in the direction comprises a first portion and a second portion thicker than the first portion to cover the electrode lead.

Light-emitting diode package

Light emitting diode

Growing community of inventors

Seoul, South Korea

Min-Sik Kim