Samsung Electronics Co., Ltd.

Min-seung Yoon

Yun-seok Choi

Seung-Kwan Ryu

Yu-Kyung Park

An interposer includes: a base substrate; an interconnection structure on a top surface of the base substrate and including a metal interconnection pattern; an upper passivation layer on the interconnection structure and having compressive stress; a lower passivation layer under a bottom surface of base substrate, the lower passivation layer having compressive stress that is less than the compressive stress of the upper passivation layer; a lower conductive layer under the lower passivation layer; and a through electrode penetrating the base substrate and the lower passivation layer. The through electrode electrically connects the lower conductive layer to the metal interconnection pattern of the interconnection structure.

Growing community of inventors

Yongin-si, South Korea

Min-seung Yoon