Center for Integrated Smart Sensors Foundation

Warp Solution Inc.

Min Seok Han

Young Ki Kim

Kyung Hak Lee

Disclosed is a method of packaging a power amplifier module. The method of packaging a power amplifier module includes providing a unified pattern including a ceramic layer and a pattern formed on the ceramic layer, bonding the unified pattern on a metal layer, and depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, on the unified pattern bonded the metal layer.

Method of packaging a power amplifier module having a unified pattern and ceramic sidewall

A band-type electronic device and an antenna module included therein are provided. The band-type electronic device includes a band configured to be worn on a body of a user, a metal housing configured to connect to the band, and a frequency control module configured to operate such that the metal housing is used as a wireless charging antenna.

Growing community of inventors

Gyeonggi-do, South Korea

Min Seok Han