Samsung Electro-mechanics Co., Ltd.

Min-Sang Lee

Je-Gwang Yoo

Han-Seo Cho

Suk-Hyeon Cho

Seon-Goo Lee

A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.

Growing community of inventors

Suwon-si, South Korea

Min-Sang Lee