Msi Computer(shenzhen)co., Ltd.

Min-Lang Chen

Hung Cheng Chang

Hsueh-Lung Cheng

The disclosure is related to an identity recognition device. The identity recognition device includes a thermal conductive casing, an identity recognition module, a heat dissipation assembly, and a heat dissipation coating. The heat dissipation assembly includes a plurality of heat pipes, a heat absorbing block and a first heat sink. The heat pipes are disposed on the thermal conductive casing, and are in thermal contacts with the thermal conductive casing. The heat absorbing block is in thermal contacts with the identity recognition module, and two opposite sides of the first heat sink respectively are in thermal contacts with the heat pipes and the heat absorbing block. The heat dissipation coating is coated on the thermal conductive casing and the heat pipes, wherein the thermal conductivity of the heat dissipation coating is larger than the thermal conductivities of the thermal conductive casing and the heat pipes.

Identity recognition device

An electronic device comprises a metal casing, a circuit board and a heating assembly. The metal casing has a storage space. The circuit board is located in the storage space. The heating assembly comprises a first heating part and a second heating part. The first heating part is in thermal contact with the circuit board, and the second heating part is in thermal contact with the metal casing.

Electronic device

A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet. The cooling module includes a first body, a second body, a first cooling component and a cooling duct. The first body is connected to the liquid outlet. The second body is connected to the liquid outlet, and the first body is disposed above the second body. The first cooling component is disposed between the first body and the second body. The cooling duct is connected to the first body and the second body, and the cooling duct is in thermal contact with the first cooling component.

Liquid cooling apparatus

A liquid-cooling module includes a liquid-providing component, a liquid-receiving component and at least one heat dissipating assembly. The liquid-providing component has a liquid inlet and a plurality of liquid-providing openings, while the liquid inlet is used for being connected to a cooler. The liquid-receiving component has a plurality of liquid-receiving openings and a liquid outlet, and the liquid outlet is used for being connected to the cooler. The at least one heat dissipating assembly includes a flow tube. One end of the flow tube is detachably connected to one of the plurality of liquid-providing openings, and the other end of the flow tube is connected on one of the plurality of liquid-receiving openings.

Growing community of inventors

Taipei, Taiwan

Min-Lang Chen