Amkor Technology, Inc.

Hyundai Motor Company

Kia Motors Corporation

Amkor Technology Singapore Holding Pte. Ltd.

Kia Corporation

Aptiv Korea LLC

Min Kyun Yoo

Won Chul Do

Jae Hun Bae

Min Hwa Chang

Young Rae Kim

Dong Hyun Kim

Ah Ra Jo

Seok Geun Ahn

Woo Young Lee

Ji Young Chung

Hoon Ki Lee

Min Jae Lee

Dae Byoung Kang

Sang Bok Won

Uk Il Yang

Seul Ki Han

Ji Eun Won

Jae Pil Hwang

Bae Yong Kim

Hyung Sun Jang

Bo Young Yun

Su Min Jo

Dong Hee Lee

Hyok Jin Chong

Tae Seong Kim

Min Woo Kang

Seung Jae Lee

Sung Kyu Kim

Jae Jin Lee

Ki Wook Lee

Seung Joon Lee

Sang Won Kim

Bong Chan Kim

Byung Jun Kim

Kyoung Jun Lee

Jae Dong Kim

Dong Gu Lee

Min Ho Park

Jae Kyu Song

Boo Yang Jung

Jun Kwon Jee

Byung Gi Hong

Soo Bin Jeon

Jun Su Lee

Gi Hyun Seo

Kyu Ho Park

A semiconductor device includes a low-density substrate, a high-density patch positioned inside a cavity in the low-density substrate, a first semiconductor die, and a second semiconductor die. The first semiconductor dies includes high-density bumps and low-density bumps. The second semiconductor die includes high-density bumps and low-density bumps. The high-density bumps of the first semiconductor die and the high-density bumps of the second semiconductor die are electrically connected to the high-density patch. The low-density bumps of the first semiconductor die and the low-density bumps of the second semiconductor die are electrically connected to the low-density substrate.

Semiconductor device and manufacturing method thereof

An object-tracking method includes using the velocity of a track for tracking an object, generated from a point cloud related to the object, in a current recognition period to obtain a current velocity-based heading angle of the track. The method includes accumulating scores associated with information about the current velocity-based heading angle and incorporating the accumulated scores into a heading history having regions sectioned for respective heading angles of the track. The method includes obtaining a history-based heading angle of the track using the heading history, correcting the history-based heading angle using information about the shape of the track, and determining the result of correction to be a final heading angle in the current recognition period.

Method and apparatus for tracking an object and a recording medium storing a program to execute the method

A sensor fusion target prediction device and method for vehicles that can estimate a prediction value in the state in which no current measurement value is present, and a vehicle including the device are disclosed. The sensor fusion target prediction device may include a learning unit for receiving sensor fusion target information and learning one or more parameters based on the received sensor fusion target information, a prediction unit for, upon receiving current sensor fusion target information, calculating a prediction value of the current sensor fusion target information based on the one or more parameters learned by the learning unit, and a target tracking unit for determining whether the sensor fusion target information is received and tracking a target using the prediction value calculated by the prediction unit based on not receiving the sensor fusion target information.

Sensor fusion target prediction device and method for vehicles and vehicle including the device

A door opening control apparatus and a door opening control method thereof are provided. The door opening control apparatus includes a recognizer configured to recognize a surrounding obstacle based on sensor recognition information received from a plurality of sensors, a determiner configured to calculate a maximum opening angle of a door for preventing collision with the recognized surrounding obstacle and to determine a risk of collision between the door and the surrounding obstacle based on the calculated maximum opening angle, and a controller configured to control an opening angle of the door to prevent the door from colliding with the surrounding obstacle when determining that the risk of collision is present.

Apparatus and method for controlling door opening

Disclosed are an occupancy distance map (ODM) information reliability determination system and method and a vehicle using the same. The system includes a signal conversion unit configured to receive a plurality of sensing signals and to perform signal processing, a calculation unit configured to calculate state information of a nearby vehicle detected from processed signals, a sensor fusion track output unit configured to output sensor fusion track information based on the calculated state information of the nearby vehicle, an ODM output unit configured to output ODM information based on the calculated state information of the nearby vehicle, an ODM fusion unit configured to generate sensor fusion ODM information by performing sensor fusion with respect to the ODM information, and an ODM information reliability determination unit configured to determine reliability of the sensor fusion ODM information by confirming association between the sensor fusion track information and the sensor fusion ODM information.

ODM information reliability determination system and method and vehicle using the same

An apparatus and method for identifying a short cut-in vehicle, and a vehicle using the same are disclosed. The apparatus includes a signal conversion unit configured to receive and signal-process a plurality of sensing signals, a computation unit configured to compute state information of a surrounding vehicle detected from the signal-processed signal, a sensor fusion track output unit configured to output a sensor fusion track based on the computed state information of the surrounding vehicle, an occupancy distance map (ODM) output unit configured to output ODM information including a grid map corresponding to a vehicle detection region and an ODM object including a plurality of detection points based on the computed state information of the surrounding vehicle, and a cut-in vehicle identification unit configured to identify a cut-in vehicle based on the output sensor fusion track and ODM information.

Apparatus and method for identifying short cut-in vehicle and vehicle using the same

Semiconductor device

A false target distinguishing apparatus includes an image matching unit configured to match coordinate information about an acquired two-dimensional image with coordinate information about an acquired three-dimensional image, a target mapping unit configured to map sensed target information to a matching image matched with the coordinate information, a region-of-interest extraction unit configured to select a target mapped to the matching image as a region of interest and to extract the selected region of interest, and a determination unit configured to perform false target classification/learning by determining whether the extracted region of interest is a false target.

Apparatus and method for distinguishing false target in vehicle and vehicle including the same

A semiconductor device is disclosed that may include a first semiconductor die comprising a copper pillar, a second semiconductor die comprising a copper pillar, and a conductive bump connecting the copper pillar of the first semiconductor die to the copper pillar of the second semiconductor die. The first semiconductor die may comprise a metal dam formed between the copper pillar and a bond pad on the first semiconductor die. The conductive bump may have a melting point lower than melting points of the copper pillar of the first semiconductor die and the copper pillar of the second semiconductor die. The first semiconductor die may be coupled to a substrate with a conductive wire coupled to the bond pad and to the substrate. The first semiconductor die may comprise a redistribution layer formed beneath the copper pillar on the first semiconductor die.

Semiconductor device with metal dam and fabricating method

A lane change device, a system including the same, and a method thereof are provided. The lane change system includes a sensor unit that senses a rotational angular velocity of a turn signal lever of a subject vehicle, an electric field signal of a gear lever of the subject vehicle, and distances between the subject vehicle and neighboring vehicles. A processor then sets a driving mode using the rotational angular velocity, the electric field signal, and the distances between the subject vehicle and the neighboring vehicles, generates a lane change path based on the driving mode, and executes a lane change of the subject vehicle.

Lane change device, system including the same, and method thereof

A semiconductor device has a first semiconductor die having at least one metal pillar formed along an inner perimeter and at least one bond pad formed along an outer perimeter. A second semiconductor die has at least one metal pillar. A conductive bump connects the at least one metal pillar of the first semiconductor die to the at least one metal pillar of the second semiconductor die. At least one metal dam is formed on the first semiconductor die between the at least one metal pillar of the first semiconductor die and the at least one bond pad.

A semiconductor device and a fabricating method thereof are provided. In one exemplary embodiment, a plurality of semiconductor dies are mounted on a laminating member, for example, a copper clad lamination, having previously formed conductive patterns, followed by performing operations of encapsulating, forming conductive vias, forming a solder resist and sawing, thereby fabricating a chip size package in a simplified manner. Fiducial patterns are further formed on the laminating member, thereby accurately positioning the semiconductor dies at preset positions of the laminating member.

Semiconductor device and fabricating method thereof

A circuit board has an insulative layer including a first surface and a second surface opposite to the first surface. A plurality of electrically conductive patterns is formed on the first surface of the insulative layer. Conductive lands are formed in a die mounting region of the first surface of the insulative layer and electrically connected to one of the plurality of conductive patterns on the first surface. An extending pattern extends from the conductive lands to outside of the mounting region. A protective layer covers the first surface of the insulative layer and the electrically conductive patterns. A trench is formed in the protective layer to expose the conductive lands and the extending patterns.

Circuit board and semiconductor device having the same

Growing community of inventors

Seoul, South Korea

Min Kyun Yoo