Skhynix Inc.

Cj Cheiljedang Corporation

Industry-academic Cooperation Foundation, Yeungnam University

Gj Cheiljedang Corporation

Mepion Co., Ltd.

Min Kyu Kang

Jun Young Jung

In Sung Lee

Il Chul Kim

Yong Bum Seo

Jun-Woo Kim

Gyu Jei Lee

Jae Hyun Son

Chul Keun Yoon

Gyeonghwan Kim

Dong Kil Shin

Je-won Hong

Juun Park

Ji Hyeok Shin

Jung Min Lee

Sun Hee Park

Min Sup Kim

Jung Hyuk Nam

Doo Yeol Choi

Disclosed is a method for producing an anti-adhesion film. The method for producing an anti-adhesion film may include: a discharge step of separately electrospinning a biodegradable polymer solution filled in a first syringe and a crosslinking agent solution filled in a second syringe; and a film forming step of forming an anti-adhesion film by crosslinking of the biodegradable polymer by contact between the biodegradable polymer solution discharged in the form of fibers in the discharge step and the crosslinking agent solution discharged in the form of droplets in the discharge step.

Method for manufacturing adhesion-preventing film

Provided is a method of preparing L-homoserine, the method including contacting an L-homoserine derivative with a solid acid catalyst.

Method of preparing L-homoserine

A semiconductor package includes a first semiconductor chip and a second semiconductor chip which are disposed side-by-side on a surface of a package substrate. A heat insulation wall is disposed between the first semiconductor chip and the second semiconductor chip. The heat insulation wall thermally isolates the first semiconductor chip from the second semiconductor chip.

Semiconductor packages including a heat insulation wall

The present disclosure relates to a preparation method of a methionine-metal chelate, and the methionine-metal chelate, which is prepared by first reacting Ca(OH)and methionine and adding metal chloride salts, can be used as feeds and feed additives.

Methionine-metal chelate and manufacturing method thereof

A semiconductor package includes a plurality of stacked first semiconductor chips disposed over a substrate. At least a portion of the plurality of stacked first semiconductor chips is encapsulated in a first mold layer. The semiconductor package also includes a plurality of stacked second semiconductor chips disposed over the topmost chip of the stacked first semiconductor chips and the first mold layer. The semiconductor package also includes a third semiconductor chip disposed over the first mold layer and adjacent to the stacked second semiconductor chips. At least a portion of the third semiconductor chip overlaps with a portion of one or more of the stacked second semiconductor chips.

Semiconductor packages having stacked chip structure

The present disclosure relates to a preparation method of a methionine-metal chelate, and the methionine-metal chelate, which is prepared by first reacting Ca(OH)and methionine and adding metal nitrate, can be widely used as feeds and feed additives.

A semiconductor package includes a package substrate, a first chip stack, a second chip stack, and a supporting block. The first chip stack includes first semiconductor chips stacked on the package substrate to be offset in a first direction, and the second chip stack includes second semiconductor chips stacked on the first chip stack to be offset in a second direction. The supporting block includes a through via structure. The second chip stack is supported by the first chip stack and the supporting block.

Semiconductor packages including a supporting block supporting an upper chip stack

A method includes providing a device under test, which includes a lower test layer and an upper test layer that is stacked on the lower test layer and includes an overhang protruding past an edge of the lower test layer by a predetermined length, fixing the lower test layer onto a mounting stage, and measuring adhesive force of an interlayer adhesive layer in a tensile mode by applying a load to a bottom surface of the overhang of the upper test layer in a first direction. An apparatus includes a mounting stage fixing the device under test, a load applying tip applying the load to the bottom surface of the overhang, a location adjuster adjusting a distance between the device under test and the load carrying tip, a load cell detecting a magnitude of the applied load, and a controller controlling the location adjuster and the load cell.

Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same

Growing community of inventors

Seoul, South Korea

Min Kyu Kang