Semes Co., Ltd.

Min Jung Park

Jung Yul Lee

Choongki Min

Kyungjin Seo

Hyun Hee Lee

Soo Hyun Cho

Younghun Jung

Jae Hoon Park

Moon Hyung Bae

Soo Bin Yong

Eun Saem Ahn

The inventive concept provides a substrate treating method. The substrate treating apparatus includes first treating including supplying a first liquid to a rotating substrate; and second treating including supplying a second liquid to the rotating substrate after the supplying of the first liquid, and wherein a rotation speed of a substrate is changed during the supplying of the first liquid to the rotating substrate.

Apparatus for treating substrate and method for treating a substrate

The inventive concept provides a method for treating a substrate. In the substrate treating method, a liquid film is formed by supplying a treatment liquid to the rotating substrate, and a wetting medium is sprayed in a form of fine particles to the substrate to help diffusion of the liquid film.

Method and apparatus for treating substrate

A nozzle apparatus may comprise a nozzle body having a nozzle tip with a discharge port for spraying a treatment fluid onto a substrate; a nozzle moving member for moving the nozzle body relative to the substrate; a rotating member for rotating the nozzle body or the nozzle tip so that a treatment fluid is sprayed onto the substrate during rotation; and a control unit configured to control an operation of the nozzle moving member and the rotating member.

Nozzle apparatus and apparatus for treating substrate

An apparatus for treating a substrate includes a heat treatment chamber having an interior space, a housing that is provided in the interior space and that has a treatment space therein, a gas supply line that supplies, into the treatment space, a hydrophobic gas for hydrophobicizing the substrate, and a decomposition unit that decomposes an alkaline gas leaking from the treatment space to the interior space.

Apparatus for treating substrate

An apparatus for treating a substrate includes an index module and a treatment module that treats the substrate. The index module includes a load port on which a carrier having a plurality of substrates received therein is loaded and a transfer frame that is disposed between the treatment module and the load port and that transfers the substrate between the carrier loaded on the load port and the treatment module. The treatment module includes one or more process chambers and a transfer chamber that transfers the substrate to the process chambers. The transfer chamber includes a housing having a transfer space in which the substrate is transferred, a transfer robot that is disposed in the housing and that transfers the substrate between the process chambers, and an electrostatic pad that is provided in the transfer space and that electro-statically attracts particles in the housing.

Transfer unit and substrate treating apparatus including ihe same

The inventive concept provides a substrate treating apparatus and a substrate treating method. The sub substrate treating apparatus may include a support unit that supports a substrate, a liquid supply unit that supplies a liquid onto the substrate supported by the support unit, and a controller that controls the liquid supply unit and the support unit, the liquid supply unit may include a pre-treatment nozzle that discharges a first treatment liquid in a stream scheme, and a main nozzle that discharges a second treatment liquid in a liquid curtain scheme, and the controller may control the support unit such that a rotational direction of the substrate when the first treatment liquid is discharged from the main nozzle and a rotational direction of the substrate when the second treatment liquid is discharged from the pre-treatment nozzle are opposite to each other.

Substrate treating apparatus and substrate treating method

Disclosed are an apparatus and a method for treating a substrate. The method includes repeatedly rotating the substrate alternately at a first speed and at a second speed while the treatment liquid is supplied, and the second speed is higher than the first speed.

Apparatus and method for treating substrate

Disclosed are a method and an apparatus for applying a liquid onto a substrate. The method for treating a substrate, the method includes: a liquid supplying step of supplying a treatment liquid for forming a liquid film on the substrate while rotating the substrate; and a liquid diffusing step of diffusing the treatment liquid discharged to the substrate by rotating the substrate, after the liquid supplying step. The liquid diffusing step includes: a primary diffusion step of rotating the substrate at a first diffusion speed; and a secondary diffusion step of rotating the substrate at a second diffusion speed, after the primary diffusion step. The second diffusion speed is higher than the first diffusion speed. Accordingly, the treatment liquid can be applied to the substrate again by performing the secondary diffusion step, making it possible to adjust the thickness of a photosensitive film.

Growing community of inventors

Daegu, South Korea

Min Jung Park