Samsung Electronics Co., Ltd.

Min Huh

Il Gyu Kim

Woo-Jin Lee

Jong Min Baek

Young-Ju Park

Jong-Sam Kim

Woo-Kyung You

YoungWoo Cho

Kyoung Woo Lee

Kyoung-Woo Lee

Su Hyun Bark

Young-Sang Lee

Soon Gyu Hwang

A semiconductor device includes a substrate, a first lower wiring line on the substrate, a first insulation layer on the first lower wiring line, a first dielectric barrier layer and a first etch stop layer sequentially stacked on the first insulation layer, a second insulation layer on the first etch stop layer, a first upper wiring line extending through the second insulation layer, the first etch stop layer, and the first dielectric barrier layer, and a first conductive via in the first insulation layer and electrically connecting the first lower wiring line and the first upper wiring line. An upper surface of the first conductive via protrudes above a lower surface of the first upper wiring line.

Semiconductor device

A method for fabricating a semiconductor device includes sequentially forming an interlayer insulating layer and a hard mask pattern including a first opening on a substrate including a lower pattern, forming a trench exposing the lower pattern in the interlayer insulating layer using the hard mask pattern, forming a liner layer including a first part formed along sidewalls and a bottom surface of the trench and a second part formed along a top surface of the hard mask pattern, forming a sacrificial pattern exposing the second part of the liner layer in the trench, removing the second part of the liner layer and the hard mask pattern using the sacrificial pattern, and after the removing of the hard mask pattern, removing the sacrificial pattern to expose the first part of the liner layer.

Methods for fabricating semiconductor devices using liner layers to avoid damage to underlying patterns

Growing community of inventors

Seoul, South Korea

Min Huh