Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Amkor Technology, Inc.

3e Co. Ltd.

Amkor Technology Singapore Holding Pte. Ltd.

Lg Electronics Inc.

Lg Innotek Co., Ltd.

Samsung Display Devices Co., Ltd.

Other

Hyundai Motor Company

Kia Motors Corporation

Industry-university Cooperation Foundation Hanyang University

Snu Rdb Foundation

Ajou University Industry-academic Cooperation Foundation

Lms Co., Ltd.

Min Ho Kim

Choong Hoe Kim

Yang Gyoo Jung

Dong Soo Ryu

Youn Seok Song

Tae Ho Yoon

Young Gu Jin

Tae Chan Kim

Kwang Hyun Lee

Tae Yon Lee

Dong Ki Min

Tae Seok Oh

Sang Chul Sul

Hoon Hur

Seung Se Kim

Won Do Kee

You Min Cha

Jung Hoon Jung

Seuk Hwan Park

Dong Su Ryu

Chan Sung Jeong

Jung Nam An

Ho Young Lee

Yong Kim

Sang Don Lee

Jin Ho Hwang

Chul Min Kim

Jin Woo Lee

Jong Min Kim

Young-Gu Jin

Dae Ig Jung

Jong Hoon Park

Choon Heung Lee

Yong Seok Choi

Sung Chul Park

Seung Hyeok Chang

Ju Hoon Yoon

Jong Pil Lee

Sung Min Lee

Jae Ho Hwang

Dong Hyun Yeom

Jae Min Lim

Sang-Bo Lee

Min Ho Cho

Jin-Kyung Lee

Suk Ho Yoon

Gi-Sang Lee

Hyun Yong Choi

Jeong Wook Lee

Jae Hwan Lee

Ji Yoon Park

Jee Hong Min

Dong-wook Kwon

Ju Hwan Jung

Sang Bin Lee

Kyung-Il Kim

Moon Soo Chang

Jin-Wuk Choi

Se Jin Oh

Jong Uk Seo

Jung-seop Kim

Heon Ho Lee

Jong Wu Baek

Eun Su Lee

Woo Jong Lee

In Hyung Jung

Cheong Jae Lee

Min Hwan Kim

Jwa Min Nam

Seok Ho Na

Chan Ha Hwang

Kyung Il Kim

Dong Cheol Lee

Sang Heon Kim

Jang Mi Kim

Keon Hun Lee

Jin Kyung Lee

Ui Jong Kim

Bum Suk Lee

Gi Sang Lee

Sang Bo Lee

Jin Wuk Choi

Seong Ho Jeong

Dong Wook Kwon

Jai Won Jean

William Solari

In Jun Son

Tae In An

Kee Won Lee

Jong Kyeom Lee

Ki Yeon Kim

Jin Yeon Choi

Suk Bok Lee

Du Yi Kim

Jae Deok Jeong

Kyu Won Kim

Hyun Woo You

Wan Woo Park

Jae Ho Sim

Zhe Li

A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

Laser-assisted bonding apparatus for bonding an electronic device to a substrate

The present inventive concept relates to a deposition system including: a deposition device having a chamber, a seating plate located inside the chamber to seat a wafer, a magnet coupled to the underside of the seating plate, and a mask assembly located inside the chamber; and a transfer device having a load lock chamber for accommodating the wafer, an arm member for transferring the wafer from the load lock chamber to the seating plate, and a fourth driving module for moving the arm member, wherein the deposition device includes a first driving module for moving the magnet and the seating plate, a second driving module coupled to the first driving module to move the magnet, a third driving module for moving the wafer, and a control module for controlling the first driving module, the second driving module, the third driving module, and the fourth driving module.

Deposition device having contact structure and deposition system having same

A display device is provided. A display device includes a display panel including a plurality of connecting signal wires which supply different control voltages; a flexible printed circuit board attached to a side surface of the display panel and including a base film and a plurality of lead wires which are disposed on the base film; an anisotropic conductive film disposed between the plurality of connecting signal wires and the plurality of lead wires, and at least one bump wire disposed between adjacent connecting signal wires, the at least one bump wire being not supplied with the different control voltages controlling the display panel.

Display device

In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.

Hybrid bonding interconnection using laser and thermal compression

System and method for laser assisted bonding of an electronic device

Disclosed herein is a device for reducing noise using a sound meta-material. The device for reducing noise includes a sound-absorbing layer configured to absorb noise generated from a sound source, a buffer layer configured to buffer an impact, and a meta-material panel layer disposed between the sound-absorbing layer and the buffer layer. The meta-material panel layer is configured with a unit cell formed by stacking one or more block cells, and one or more unit cells are disposed on a plane of the meta-material panel layer.

Device for reducing noise using sound meta-material

According to one embodiment of the present invention, a method for coding an iris pattern divides an iris area into a plurality of sectors on the basis of the assumption that a user's pupil and iris are not circular and then can code an iris pattern included in each sector. According to the present invention, an error occurrence frequency can be minimized compared with a case that an iris pattern is coded on the basis of the assumption that a pupil and an iris are circular.

Method for coding iris pattern

The present invention provides an integrated optical sheet module where an optical sheet is integrally formed without a diffusion sheet, a condensing sheet and a reflective polarizing sheet thereby reducing the overall thickness and improving the viewing angle, so that a manufacturing process can be simplified and significantly improve the left to right viewing angle while minimizing the brightness drop by forming the first base film having the viewing angle improvement component on the bottom surface with a haze characteristic.

Integrated optical sheet module and backlight unit having same

The present invention relates to a core-shell nanocomposite including fluorescent bodies disposed to have a uniform distance in a perpendicular direction from a surface thereof, to a method of manufacturing same, and to a use for a probe for metal-enhanced fluorescence.

Core-shell nanocomposite for metal-enhanced fluorescence

Disclosed is an electronic device. The electronic device comprising: a display including a touch screen; a biometric sensor; a communication circuit; a memory; and at least one processor electrically connected to the display, the biometric sensor, the memory, and the communication circuit, wherein the memory stores a plurality of instructions that, when executed, causes the processor to: receive an electronic document from at least one server using the communication circuit; obtain biometric information associated with a user using the biometric sensor; transmit the biometric information associated with the user to the at least one server through the communication circuit; obtain a signature of the user associated with the electronic document using the display; encrypt the obtained signature with specified data associated with the biometric information; and transmit the encrypted signature and at least one of the electronic document and identification information of the electronic document by using the communication circuit.

Electronic device for including signature in electronic document and method of controlling the same

Disclosed are a method and an apparatus for verifying times and locations of image data of cameras for vehicles. The method for verifying times and locations of image data of cameras for vehicles includes anonymously receiving digests including locations and times of data created by cameras for a plurality of vehicles, respectively, forming a mesh structure by bi-directionally connecting the cameras for the plurality of vehicles to cameras for adjacent vehicles, based on a relationship between the received digests, and if the mesh structure is formed, verifying times and locations for the digests constituting the mesh structure based on the formed mesh structure.

Method and apparatus for verifying time and location of image data of camera for vehicle while anonymity of owner is guaranteed

A linear evaporation source is disclosed. In one aspect, the source includes a crucible storing an evaporated material, a heater unit surrounding the crucible and heating the crucible, and a plurality of lateral reflectors surrounding a lateral surface of the heater unit. Each of the lateral reflectors includes a first reflector combined with the heater unit while being spaced apart from the heater unit and having a plurality of first openings and a second reflector movably combined with the first reflector and having a second opening. Open ratios of the lateral reflectors are independently adjusted to control a temperature of the crucible according to areas of the crucible. Thus, deposition uniformity of the linear evaporation source is enhanced.

Linear evaporation source and vacuum deposition apparatus including the same

The method includes receiving an image of a user's eye region, selecting pixels included in a central region of the image, calculating an average value of brightness values of a plurality of adjacent pixels among the pixels included in the central region, converting the plurality of adjacent pixels into one pixel having the average value as a brightness value, comparing the brightness values of the converted pixels with a critical value to binarize the converted pixels, so as to create a binarized image, detecting a row including a pixel located at an uppermost end of pixels corresponding to a pupil, from the binarized image and correcting the position of the central region such that the pupil is located at the center of the image, based on position information of the row including the pixel located at the uppermost end of the pixels corresponding to the pupil.

Method of detecting pupil center

An iris verification method is provided. According to the iris verification method, it is possible to determine whether the iris to be authenticated is a real human iris during an iris authentication process. Also, according to the iris verification method, it is possible to determine, with precision, whether iris images to be authenticated are real human iris images.

Iris verification method

Growing community of inventors

Seoul, South Korea

Min Ho Kim