Lsis Co., Ltd.

Hyundai Mobis Co., Ltd.

University-Industry Cooperation Group of Kyung Hee University

Min Heo

Dong Hyun Lee

Jun Seok Eom

Il Keun Kwon

Bo Hyun Youn

Dong Nyoung Heo

Yu Cheol Park

Sang Jin Lee

Eun Soo Jung

Bohyun Youn

A modular inverter including a capacitor unit including two or more capacitors arranged at a first side, a first capacitor busbar contacting a lower end of the capacitor unit and including a first capacitor connection portion including a first portion located on a second side of an upper end of the capacitor unit, a second capacitor busbar covering the upper end of the capacitor unit and including a second capacitor connection portion including a second portion extending outwardly to a third side of the upper end of the capacitor unit, a cooling unit disposed above the second capacitor busbar, and one or more power modules disposed above the cooling unit, the one or more power modules including a first power module busbar and a second power module busbar extending to the third side of the upper end of the capacitor unit and connected to the second capacitor connection portion.

Modular inverter and large-capacity inverter assemblies including the modular inverter

The present invention relates to a method of manufacturing a nerve electrode in which a conductive ink is inkjet printed on an electrospun polyimide fibrous sheet; and a nerve electrode manufactured by the manufacturing method.

Method of manufacturing nerve electrode

A magnetic device is provided. The magnetic device includes a bobbin including a hollow portion extending in a longitudinal direction, coils wound around the outside of the bobbin, a core coupled to the bobbin outside the bobbin. The bobbin includes a first winding portion around which the coil is wound, a second winding portion which is disposed at one side of the first winding portion in the longitudinal direction, and around which the coil is wound, a tolerance relief part disposed between the first and second winding portions, coupling parts symmetrically disposed to each other on the outsides of the first and second winding portions, respectively. The tolerance relief part is elastically deformable in the longitudinal direction.

Magnetic device

Provided is a coupling assembly of a power semiconductor device and a printed circuit board (PCB). The coupling assembly of the power semiconductor device and the printed circuit board (PCB) includes a PCB, a power semiconductor device comprising a plurality of legs electrically connected to a circuit pattern disposed on the PCB, a connection member disposed above the power semiconductor device, the connection member being formed of an electrically conductive material, a main fixing unit fixing the power semiconductor device to the PCB, and a housing disposed outside the PCB. Thus, a coupling force between the power semiconductor device and the PCB and electric efficiency may be improved to a heat generation amount. In addition, heat may be more quickly dissipated through the connection member to improve a cooling effect.

Coupling assembly of power semiconductor device and PCB and method for manufacturing the same

A filter assembly is provided. The filter assembly includes a printed circuit board (PCB) including a plurality of electronic components, a base disposed under the PCB, and an inductor coupled to the base, the inductor including a core and a coil to which current is applied, wherein the PCB has a through-hole through which at least one portion of the coil pass.

Filter assembly

The present disclosure relates to an apparatus for fastening a power semiconductor using an integral springy (elastic) clip, capable of fixing a power semiconductor, such as a diode and a MOSFET, using elasticity of a U-shaped clip by integrally molding the clip onto a housing of a plastic module. The apparatus includes an elastic (springy) clip integrally molded onto a lower surface of the housing and downwardly curved into a U-like shape in a bridge module in which a bridge of the power semiconductor protrudes through a through hole of the housing to be connected to a printed circuit board, whereby the power semiconductor is fixed by a force that the housing presses the power semiconductor.

Growing community of inventors

Seoul, South Korea

Min Heo