Innolux Corporation

Min-Han Tsai

Hao-Jung Huang

Kuang-Pin Chao

Chien-Tzu Chu

Yung-Kan Chen

Chia-Hsien Lin

A splicing device includes a first splicing unit and a second splicing unit. The first splicing unit includes a first substrate, a first light-emitting unit, and a second light-emitting unit. The second splicing unit includes a second substrate, a third light-emitting unit, and a fourth light-emitting unit. P is a pitch between the first light-emitting unit and the second light-emitting unit, and a pitch between the third light-emitting unit and the fourth light-emitting unit. LAis a horizontal distance from a center of the second light-emitting unit to a first reference plane. LBis a horizontal distance from a boundary between a light-emitting surface of the second splicing unit and a second reference plane to the first reference plane. LBand LBare respectively a horizontal component and a vertical component of a distance from the boundary to a center of the third light-emitting unit. LAis a vertical distance from the light-emitting surface of the first splicing unit to a bottom surface of the first substrate. LBis a vertical distance from the bottom surface of the first substrate to the boundary. The splicing device satisfies:

Splicing configuration of display devices

An electronic device is provided. The electronic device includes: a support structure, a heat-dissipation layer, a first adhesive and an electronic panel. The heat-dissipation layer is disposed on the support structure and includes at least one first hole. The first adhesive is disposed in the at least one first hole. The electronic panel is disposed on the heat-dissipation layer.

Electronic device

A method of fabricating a pixel structure for an organic light-emitting display (OLED) is disclosed. A substrate having at least a sub-pixel region is provided. An auxiliary electrode layer and an insulating layer are formed on the substrate in the sub-pixel region, wherein the insulating layer has an opening to expose the auxiliary electrode layer. A lower electrode layer, an organic light emission layer, and an upper electrode layer are formed on the substrate, wherein the organic light emission layer fills the opening in the insulating layer. Another opening is formed in the upper electrode layer and the organic light emission layer directly on the opening in the insulating layer by performing a laser process, such that the upper electrode layer and the auxiliary electrode layer are welded together through the opening in the upper electrode layer and the organic light emission layer.

Method of fabricating pixel structure for organic light-emitting display

An organic light emitting display device includes a first substrate, an organic light emitting diode array, a thin film encapsulation layer, a second substrate, a sealant member and a buffer layer. First substrate has a light emitting region and a non-light emitting region. OLED array is configured in light emitting region covered by encapsulation layer. Second substrate has a color filter array and is arranged opposite first substrate. Sealant member is disposed between first and second substrates. Buffer layer has a first light shielding layer disposed thereon, is arranged between first and second substrates, and is configured in light emitting region. Light shielding layer is arranged between buffer layer and encapsulation layer. The sum of the buffer layer's thickness and a gap distance from buffer layer to encapsulation layer has a range from 5 to 20 &#x3bc;m. Buffer layer has hardness smaller than that of the color filter array.

Growing community of inventors

Miao-Li County, Taiwan

Min-Han Tsai