Dongjin Semichem Co., Ltd.

Min Gun Lee

Jong Dai Park

Sung Hoon Jin

Jae Hyun Kim

Kyu Soon Shin

Jong Chul Shin

Hye Jung Park

Goo Hwa Lee

Weoun Gyuen Moon

Gyeong Sook Cho

Jae Hong Yoo

The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.

Chemical-mechanical polishing particle and polishing slurry composition comprising same

Disclosed is a chemical-mechanical polishing slurry composition having a small change in pH over time under an acidic condition and thus being easy to store for a long time. The chemical-mechanical polishing slurry composition includes an abrasive; an amount of about 0.000006 to 0.01 weight % of an aluminum component based on the total weight of the polishing slurry composition; and water. The number of silanol groups on a surface of the abrasive and a content of the aluminum component satisfy the requirements of following Equation 1:0.0005&#x2264;()*100&#x2264;4.5,&#x2003;&#x2003;[Equation 1]

Polishing slurry composition

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Seoul, South Korea

Min Gun Lee