Industrial Technology Research Institute

Min-Chieh Chou

Meng-Chi Huang

Tune-Hune Kao

Horng-Jee Wang

Cheng-Tang Pan

Ya-Ru Huang

Tung-Chuan Wu

Ya-Ju Huang

Chih-Wei Chen

Hung-Yi Lin

Jian-Shian Lin

Jyh-Chun Chang

Kun-Chih Pan

Yuh-Sheng Lin

Kun-Lung Lin

Ming-Jye Tasi

Yue-Zhen Huang

Chien-Hung Zordius Chen

Ming-Jye Tsai

Wei-Yu Li

Ching-Yi Wu

Cheng-Hsuan Lin

Hung-Yin Tsai

Chen-Chin Cheng

Han-Ping Yang

Sheng-Chih Shen

Wei Chung

Shih-Chou Chen

Yu-Tang Chen

Jen-Hui Tsai

Fuh-Yu Chang

Ming-Fa Hsieh

Shih-Tung Cheng

Chuan-Kang Mu

Jung-Kang Peng

Hsi-Harng Yang

Yung-Shi Lin

Yu-Hsi Chao

Horng-Chieh Wang

Kuo-Ming Chang

Mu-Tien Liang

Jiing-Song Lu

Jar-Sian Hsiau

Arnold Chang Yang

Star Rey-Shing Huang

Jiu-Shu Tasi

Jiu-Shu Tsai

Chu-Shu Tsai

A three-dimensional circuit board, including a ceramic substrate and multiple circuits, is provided. The ceramic substrate has a first plane, a second plane, a third plane located between the first plane and the second plane, a first side surface connecting the first plane and the second plane, and a second side surface connecting the first plane and the third plane and opposite to the first side surface. A first height of the first side surface is greater than a second height of the second side surface. The circuits are separately embedded on the first plane of the ceramic substrate and extend along the first side surface to be embedded on the second plane.

Three-dimensional circuit board, manufacturing method thereof, and probe card

A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.

Probe card

A tactile sensor including an elastic dielectric layer, first ribbon electrodes, and second ribbon electrodes is provided. The elastic dielectric layer has a first surface and a second surface opposite to each other. The first ribbon electrodes are disposed on the first surface. Each of the first ribbon electrodes extends in a first direction and includes first sensing portions serially connected in the first direction. The second ribbon electrodes are disposed on the second surface. Each of the second ribbon electrodes extends in a second direction intersecting the first direction. Each of the first sensing portions has a first extending length in the first direction to cross over N second ribbon electrodes. Each of the first sensing portions has a first edge parallel to the second direction. The first edge is aligned with an edge of one of the second ribbon electrodes. N is a positive integer greater than 1.

Tactile sensor

A metal circuit structure is provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.

Metal circuit structure

A beam antenna comprising a first material layer, a second material layer, a first radiating conductor unit and an energy transmission conductor layer is provided. The first material layer has a signal source and a first conductor layer. The second material layer has a first thin-film layer, where the first thin-film layer is adhered on a surface of the second material layer. The first thin-film layer further comprises an insulating gel and a plurality of trigger particles. The first radiating conductor unit is adhered on a surface of the first thin-file layer, and the first thin-file layer is located between the first radiating conductor unit and the second material layer. The energy transmission conductor structure is disposed between the first and the second material layers, which has a first terminal and a second terminal that electrically coupled or connected to the signal source and the first radiating conductor unit respectively.

Beam antenna

A metal circuit structure, a method for forming a metal circuit and a liquid trigger material for forming a metal circuit are provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.

Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure

An optical measuring device includes a case, a reflective layer and a light collecting lens module. A measuring chamber and a channel, which is connected to the measuring chamber and is connected to an opening of the case, reside in the case. The reflective layer is disposed onto an inner surface of the measuring chamber. The light collecting lens module is located inside the channel. A light beam emits into the channel of the optical measuring device through an opening, passes through the light collecting lens module and enters the measuring chamber afterward.

Optical measuring system and optical measuring device thereof

A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.

Die structure, manufacturing method and substrate thereof

A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.

Conductive film structure, fabrication method thereof, and conductive film type probe device for IC

A method for manufacturing a conductive film as well as the structure thereof and a probe card using the same are provided in the invention. The conductive film is substantially a stacked structure of a specific thickness formed by the adhering and stacking of at least a substrate in a vacuum environment by the use of surface processing and mechanical healing whereas each substrate has an array of metal micro-threads formed thereon, in which the plural metal micro-threads, each being wrapped in an insulating film, are arranged on the substrate to form the array in a unidirectional and single-layered manner by the use of a LIGA process and polymer thin film technology. In an exemplary embodiment, the insulating film can be a polymer thin film of high dielectric constant, being made of a material such as polydimethylsiloxane (PDMA) or polyimide (PI); and the metal micro-thread is made of a high conductivity and high strength Ni&#x2014;Co alloy. Moreover, the so-formed conductive film can be cut into any desired dimensions by the use of an energy beam, such as laser beam, ion beam and plasma beam, etc. while combining the conductive film with a panel so as to be used for forming a probe card with large area detection ability that is low-cost, ease-to-maintain and capable of being adapted for wafers of various bonding pad arrangements.

Method for making a conductive film and a probe card using the same

An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

Integrated compound nano probe card and method of making same

Integrated compound nano probe card

A probe module which is particularly suitable for testing an LCD panel. The probe module includes a probe base, a plurality of probe pins provided on the probe base, and a high-density circuit interconnection which includes a flexible circuit board that connects the probe pins to a testing apparatus. The tip of each probe pin may have a pointed or tapered configuration, or alternatively, a hemi-spherical configuration.

Integrated probe module for LCD panel light inspection

The present invention relates to a method of fabricating a vertical probe head, whereas the vertical probe head is formed by the combination of at least a probe, a bottom guide plate and a top guide plate having at least a hole matching the probe. The probe is fabricated by a LIGA-like process combining with the processes of photolithography, etching and electroforming, and so on, so that the probe is equipped with comparatively better precision, strength and reliability and yet can be custom-made for satisfying various demands. In addition, both the top and bottom guide plates are made by a means of non-mechanical machining, which respectively is fabricated by processing a substrate using means of photolithography, etching and mask so as to fabricate holes for matching with the aforesaid probe. The vertical probe head of the invention is a breakthrough over the current probe head and thus breaks the bottleneck limiting the process of fabricating the same, such that the method disclosed in the invention enables the probe head to be fabricated by a cheaper and less complicated process with more probes to be arranged in a unit area.

Method of fabricating vertical probe head

Growing community of inventors

Taipei, Taiwan

Min-Chieh Chou