Samsung Electro-Mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Korea Institute of Science and Technology

Samsung Sdi Co., Inc.

Korea Electronics Technology Institute

Samsung Display Co., Ltd.

Absology Co., Ltd

Hyundai Motor Company

Sk Telecom Company, Ltd.

Cj Cheiljedang Corporation

Snu Rdb Foundation

Clemson University

Industry-Academic Cooperation Foundation, Dankook University

Korea Food Research Institute

Etamax Co., Ltd

Min Cheol Park

Sang Soo Park

Byoung Hwa Lee

Young Ghyu Ahn

Dong Seok Park

Hae Suk Chung

Sung Kwon Wi

Heung Kil Park

Sang-Soo Lee

Heesuk Kim

Kyo Kwang Lee

Min-Seok Oh

Eun Hyuk Chae

Seung-Jae Jung

Jong Hyuk Park

Doo Young Kim

Jeong Gon Son

Tae Hyeok Kim

Czang-Ho Lee

Sang Jong Lee

Young Hoon Song

Hyung Joon Kim

Young Jun Kim

Young Key Kim

Seungjun Chung

Byoung-June Kim

Jung-Tae Kim

Han Bit Kim

Doo Il Kim

Ji Seon Lee

Su Bong Jang

Bongjae Rhee

Kyungha Koo

Dong-Uk Choi

Hyun Tae Kim

Phillip Lee

Changjoon Lee

Seung Heon Han

Hyun Ju Yi

Haejin Lee

Sang Hee Park

Ji Yoon Kang

Ji-youn Han

Byunghoon Lee

Dong-Seop Kim

Yun-Seok Lee

Jin Woo Kim

Jong Ho Lee

Tae Hun Kim

Dong Hwan Lee

Jungmin Park

Seung Won Lee

Hwi Dae Kim

Dong Wook Kim

Dongil Son

Won Suk Choi

Sungchul Park

Jun Ho Song

Won Seok Lee

Young Jin Kim

Chihyun Cho

Dongku Kang

Jong Ha Lee

Jung Min Park

Min Jae Kim

Jaeyoung Huh

Moon Soo Park

Ju Hee Kim

Yonghwa Kim

Chulwoo Park

Jihong Kim

Seok Kyoon Woo

Jaedeok Lim

Seungbum Choi

Tae Ho Yun

Jungje Bang

Seok Hyun Jung

Yu Jin Kim

Byung Kook Kim

Kwang Ho Shin

Jun Hee Lim

Tae-Wook Kim

Sang Jin Hong

Hyunjung Lee

Kyong Jun Kim

Yunjang Jin

Dong Suk Kim

Gyun Heo

Soon Ju Lee

Hyunwoo Sim

Minki Kim

Sang Hyun Yang

Suna Kim

Hye-Young Kim

Kyungwoon Jang

Yi Eun Kim

Byung Hwa Jung

Jongwon Kim

Young Jun Moon

Young Ki Park

A capacitor component, includes: a body including first and second surfaces opposing each other in a first direction, wherein, in the body, a first internal electrode, a second internal electrode, a first dielectric layer interposed between the first and second internal electrodes, and a second dielectric layer disposed on the second internal electrode are wound in the first direction as a winding axis; a first external electrode disposed on the first surface and connected to the first internal electrode; and a second external electrode disposed on the second surface and connected to the second internal electrode. The first internal electrode and the second internal electrode include different metals.

Capacitor component and capacitor-embedded substrate

An automatic immunoassay system is provided to an automatic immunoassay apparatus and includes a well cartridge provided with a plurality of wells in which a tip mounted on the automatic immunoassay apparatus is sequentially dipped, a cartridge loading mechanism coupled to a lower portion of the well cartridge to couple the well cartridge to the holding plate, a light source unit disposed at one side of the cartridge unit to emit light to the wells, a sensing unit disposed at the other side of the cartridge unit to detect a fluorescence signal generated by light delivered to the wells, and an assay unit analyzing the fluorescence signals detected by the sensing unit.

Automatic immunoassay system

An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component therein and includes at least one opening formed in the area corresponding to the electric component; a heat-dissipating structure disposed in at least a part of the shield can to close at least a part of the at least one opening; and a heat transfer member disposed between and in contact with the electronic component and the heat-dissipating structure and at least a part of which is disposed in the at least one opening.

Heat dissipation structure and electronic device including same

A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and respectively disposed on first and second surfaces of the body, the first and second surfaces opposing each other. The body further includes a first via electrode, connecting the at least one first internal electrode and the first external electrode to each other in the first direction, and a second via electrode connecting the at least one second internal electrode and the second external electrode to each other in the first direction.

Multilayer capacitor and board having the same embedded therein

A capacitor component includes a body having first surface and second surfaces opposing each other and including through-holes penetrating through the first surface and the second surface, a first electrode covering an inner wall of each of the plurality of through-holes, a first common electrode covering the first surface and connected to the first electrode, a dielectric layer surrounded by the first electrode in the through-hole, a second electrode surrounded by the dielectric layer in the through-hole, a second common electrode layer covering the second surface and connected to the second electrode, a first external electrode disposed on at least one of a plurality of side surfaces of the body and connected to the first common electrode layer, and a second external electrode disposed on at least one of the plurality of side surfaces of the body and connected to the second common electrode layer.

Capacitor component including through-hole structure to increase capacitance

A capacitor component includes a body including a capacitance formation portion including a plurality of unit devices including a first internal electrode, a first dielectric film surrounding the first internal electrode, and a second internal electrode surrounding the first dielectric film, and a molded portion surrounding the capacitance formation portion, first and second external electrodes respectively disposed on a first surface and a second surface of the body opposing each other in a first direction to be respectively connected to the first and second internal electrodes. Cross-sections perpendicular to the first direction of at least two of the plurality of unit devices have a polygonal shape.

Capacitor component including unit device having polygonal-shaped cross-section

The present disclosure relates to an edge computing (multi-access edge computing, MEC) technology and, to an edge computing management device and an operating method of an edge computing management device, which provide a data roaming service by utilizing an edge computing cloud (MEC cloud) that exists in a communication provider network.

Edge computing management device and operating method of edge computing management device

A nonvolatile memory device and method of fabricating same, the nonvolatile memory device including a substrate; a first semiconductor layer on the substrate; an etching stop film including a metal oxide on the first semiconductor layer; a mold structure including second semiconductor layers and insulating layers alternately stacked on the etching stop film; a channel hole penetrating through at least one of the mold structure, the etching stop film, the second semiconductor layer and the substrate; and a channel structure extending along a side wall of the channel hole, including an anti-oxidant film, a first blocking insulation film, a second blocking insulation film, a charge storage film, a tunnel insulating film and a channel semiconductor sequentially formed along the side wall of the channel hole. The first semiconductor layer contacts the first blocking insulation film, the second blocking insulation film, the charge storage film, and the tunnel insulating film.

Nonvolatile memory device and method of fabricating same

Various embodiments disclosed in the present document relate to: a protective film configured to be attached to a display glass equipped with an ultrasonic fingerprint sensor; and an electronic device including the same. According to the various embodiments disclosed in the present document, a protective film can be provided, which is configured to be attached to an electronic device provided with an ultrasonic fingerprint sensor, the protective film comprising: a first adhesive layer configured to be attached on a front plate of the electronic device; and a first substrate layer stacked and disposed on one surface side of the first adhesive layer, integrated with the first adhesive layer, and covering the front plate.

Protective film and electronic device including same

According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.

Electrical element transfer apparatus

According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.

Electronic device having heat-radiating structure

There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as &#xbd; of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as &#xbd; of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063&#x2264;(B+C)/A&#x2264;1.745.

Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor

The present invention relates to a feed additive comprising astrain and astrain, a feed composition comprising the feed additive, and a method for producing the feed additive.

Feed additive comprisingand, a feed composition comprising the feed additive and a method for producing the feed additive

In order to provide information related to content played on a target device within a visual field or a field of view (FOV) of the camera's, and to control the target device, a mobile apparatus according to an embodiment of present disclosure includes: a display; a camera configured to photograph a target device; a user interface configured to receive user's input; and a controller configured to control the display to display the image of the target device photographed by the camera and information related to an object included in the content being played by the target device in response to the user's input.

Mobile apparatus and control method thereof to control an object displayed on a target device

The present invention relates to defects inspection on a silicon carbide wafer or an epitaxial layer thereon to determine the location, and adjustment of the location of the scribe line, which is a separation line forming a gap between adjacent dies. The present invention can obtain high efficiency and economy in the semiconductor process using wafers containing various defects in the surface and thin film, by minimizing the effect of wafer defects on the final yield of the semiconductor chip or die, via adjustment of scribe line positions arranged on the wafer.

Die division method and inspection apparatus for avoiding defects locations on silicon carbide wafers

Growing community of inventors

Gyunggi-do, South Korea

Min Cheol Park