Taiwan Semiconductor Manufacturing Comp. Ltd.

Mediatek Corporation

Min-Chen Lin

Jing-Cheng Lin

Jui-Pin Hung

Hsien-Wen Liu

Nan-Cheng Chen

Che-Ya Chou

Wen-Chou Wu

Hsing-Chih Liu

Che-Hung Kuo

Fu-Yi Han

Yi-Hang Lin

One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.

Semiconductor package having discrete antenna device

An embodiment integrated circuit structure includes a substrate, a metal pad over the substrate, a post-passivation interconnect (PPI) structure over the substrate and electronically connected to the metal pad, a first polymer layer over the PPI structure, an under bump metallurgy (UBM) extending into an opening in the first polymer layer and electronically connected to the PPI structure, and a barrier layer on a top surface of the first polymer layer adjacent to the UBM.

Integrated circuit structure and method for reducing polymer layer delamination

A semiconductor package structure including a redistribution layer (RDL) structure having a first surface and a second surface opposite thereto is provided. The RDL structure includes an inter-metal dielectric (IMD) layer and a first conductive layer disposed at a first layer-level of the IMD layer. A molding compound covers the first surface of the RDL structure. A first semiconductor die is disposed over the second surface of the RDL structure and electrically coupled to the RDL structure. A plurality of bump structures is disposed over the second surface of the RDL structure and electrically coupled to the RDL structure.

Fan-out package structure

An embodiment integrated circuit structure includes a substrate, a metal pad over the substrate, a post-passivation interconnect (PPI) structure over the substrate and electronically connected to the metal pad, a thin oxide film layer directly over a top surface of the PPI structure, and a polymer layer over the thin oxide film layer and PPI structure.

Adhesion between post-passivation interconnect structure and polymer

Growing community of inventors

Tainan, Taiwan

Min-Chen Lin