Fei Comapny

Fei Compay

Milos Toth

Steven J Randolph

Marcus Straw

Mark Utlaut

Aurelien Philippe Jean Maclou Botman

William Ralph Knowles

James Bishop

Igor Aharonovich

Clive D Chandler

Marek Uncovsky

Alexander Henstra

N William Parker

Charlene Lobo

David H Narum

Michael Lysaght

Toan Trong Tran

Aiden Martin

Eric H Silver

Noel S Smith

Richard J Young

Johannes Jacobus Lambertus Mulders

Alan Frank De Jong

Jorge Filevich

Libor Novak

Michael Ross Scheinfein

Aurélien Philippe Jean Maclou Botman

Mark Emerson

Guido Knippels

Gerardus Nicolaas Anne Van Veen

Aiden Alexander Martin

John Scott

Cameron James Zachreson

Martin Cafourek

William N Parker

Olga Shimoni

Geoff McCredie

Daniel Totonjian

Toby Shanley

Chris Elbadawi

Amin Samsavar

Rae Knowles, Legal Representative

Dolf Timmerman

Mehran Kianinia

Johannes Mulders

Methods and systems for direct lithographic pattern definition based upon electron beam induced alteration of the surface chemistry of a substrate are described. The methods involve an initial chemical treatment for global definition of a specified surface chemistry (SC). Electron beam induced surface reactions between a gaseous precursor and the surface are then used to locally alter the SC. High resolution patterning of stable, specified surface chemistries upon a substrate can thus be achieved. The defined patterns can then be utilized for selective material deposition via methods which exploit the specificity of certain SC combinations or by differences in surface energy. It is possible to perform all steps in-situ without breaking vacuum.

Nanofabrication using a new class of electron beam induced surface processing techniques

Various methods and systems are provided for imaging a sample under low vacuum with a charged particle beam. A magnetic field is provided in a detection area of the detector. Gas and plasma are provided in the detection area while detecting charged particles emitted from the sample. Sample image is formed based on the detected charged particles.

Method and system for plasma assisted low vacuum charged-particle microscopy

A method and system are disclosed for observing and aligning a beam of light in the sample chamber of a charged particle beam (CPB) system, such as an electron microscope or focused ion beam system. The method comprises providing an imaging aid inside the sample chamber with a calibration surface configured such that when illuminated by light, and simultaneously illuminated by a CPB, the intensity of the secondary radiation induced by the CPB is different in regions also illuminated by light relative to regions with lower light illumination levels, thereby providing an image of the light beam on the calibration surface. The image of the light beam may be used to align the light beam to the charged particle beam.

Method for alignment of a light beam to a charged particle beam

Beam-induced deposition decomposes a precursor at precise positions on a surface. The surface is processed to provide linker groups on the surface of the deposit, and the sample is processed to attach nano-objects to the linker groups. The nano-objects are used in a variety of application. When a charged particle beam is used to decompose the precursor, the charged particle beam can be used to form an image of the surface with the nano-objects attached.

Attachment of nano-objects to beam-deposited structures

Laser processing is enhanced by using endpointing or by using a charged particle beam together with a laser. End-pointing uses emissions, such as photons, electrons, ions, or neutral particles, from the substrate to determine when the material under the laser has changed or is about to change. Material removed from the sample can be deflected to avoid deposition onto the laser optics.

Method and apparatus for laser machining

Beam-induced etching uses a work piece maintained at a temperature near the boiling point of a precursor material, but the temperature is sufficiently high to desorb reaction byproducts. In one embodiment, NFis used as a precursor gas for electron-beam induced etching of silicon at a temperature below room temperature.

Electron beam-induced etching

Material is deposited in a desired pattern by spontaneous deposition of precursor gas at regions of a surface that are prepared using a beam to provide conditions to support the initiation of the spontaneous reaction. Once the reaction is initiated, it continues in the absence of the beam at the regions of the surface at which the reaction was initiated.

Method of depositing material

A charge transfer mechanism is used to locally deposit or remove material for a small structure. A local electrochemical cell is created without having to immerse the entire work piece in a bath. The charge transfer mechanism can be used together with a charged particle beam or laser system to modify small structures, such as integrated circuits or micro-electromechanical system. The charge transfer process can be performed in air or, in some embodiments, in a vacuum chamber.

Localized, in-vacuum modification of small structures

A cold trap is provided to reduce contamination gases that react with the beam during operations that use a process gas. The cold trap is set to a temperature that condenses the contamination gas but does not condense the process gas. Cold traps may be used in the sample chamber and in the gas line.

Charged particle beam processing using process gas and cooled surface

An environmental cell for a charged particle beam system allows relative motion between the cell mounted on an X-Y stage and the optical axis of the focusing column, thereby eliminating the need for a sub-stage within the cell. A flexible cell configuration, such as a retractable lid, permits a variety of processes, including beam-induced and thermally-induced processes. Photoelectron yield spectroscopy performed in a charged particle beam system and using gas cascade amplification of the photoelectrons allows analysis of material in the cell and monitoring of processing in the cell. Luminescence analysis can be also performed using a retractable mirror.

Environmental cell for charged particle beam system

Charged particle beam imaging and measurement systems are provided using gas amplification with an improved imaging gas. The system includes a charged particle beam source for directing a charged particle beam to work piece, a focusing lens for focusing the charged particles onto the work piece, and an electrode for accelerating secondary electrons generated from the work piece irradiation by the charged practice beam, or another gas cascade detection scheme. The gas imaging is performed in a high pressure scanning electron microscope (HPSEM) chamber for enclosing the improved imaging gas including CHCHOH (ethanol) vapor. The electrode accelerates the secondary electrons though the CHCHOH to ionize the CHCHOH through ionization cascade to amplify the number of secondary electrons for detection. An optimal configuration is provided for use of the improved imaging gas, and techniques are provided to conduct imaging studies of organic liquids and solvents, and other CHCHOH-based processes.

Electron beam microscope with improved imaging gas and method of use

A charge transfer mechanism is used to locally deposit or remove material for a small structure. A local electrochemical cell is created without having to immerse the entire work piece in a bath. The charge transfer mechanism can be used together with a charged particle beam or laser system to modify small structures, such as integrated circuits or microelectromechanical system. The charge transfer process can be performed in air or, in some embodiments, in a vacuum chamber.

The current invention includes methods and apparatuses for processing, that is, altering and imaging, a sample in a high pressure charged particle beam system. Embodiments of the invention include a cell in which the sample is positioned during high pressure charged particle beam processing. The cell reduces the amount of gas required for processing, thereby allowing rapid introduction, exhaustion, and switching between gases and between processing and imaging modes. Maintaining the processes gases within the cell protects the sample chamber and column from contact with the gases. In some embodiments, the temperature of the cell walls and the sample can be controlled.

High pressure charged particle beam system

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Portland, OR, United States of America

Milos Toth