Honeywell International Inc.

Mikulas Jandak

Michael Schneider

Ulrich Schmid

Tomas Neuzil

Petr Zatloukal

Jan Pekarek

Hana Krausova

Zbynek Drasal

Techniques relating to a micro-electro-mechanical (MEMS) device configured to measure direct axial and shear stress components of a stress tensor are described. The MEMS device includes a first and second circuit configured in a double rosette structure coupled with a third circuit in a standard rosette structure to form a triple rosette piezo-resistive gauge circuit. The first circuit includes at least one piezoresistive element suspended from a substrate, and at least one piezoresistive element fixed to the substrate. The second circuit includes each piezoresistive element fixed to the substrate. The third circuit includes at least one piezoresistive element fixed to the substrate. Additionally, the MEMS device may be coupled to one or more processing systems to determine a mechanical stress tensor that is applied to the MEMS device based on measurements received from the MEMS device.

Rosette piezo-resistive gauge circuit for thermally compensated measurement of full stress tensor

A micro-electro-mechanical systems (MEMS) device and method of fabricating the MEMS device are disclosed. The MEMS device comprises a substrate, one or more suspension structures connected to the substrate, one or more metallized layers on the one or more suspension structures, and one or more sense structures connected to the one or more suspension structures. The one or more metallized layers provide selectively adjusted damping of the one or more suspension structures.

MEMS sensors with selectively adjusted damping of suspension

A MEMS sensor device comprises a support substrate, a proof mass movably connected to the support substrate, a first drive comb fixedly connected to the support substrate in a first orientation and adjacent to the proof mass, and a second drive comb fixedly connected to the support substrate in a second orientation and adjacent to the proof mass. The second orientation is opposite of the first orientation such that the first and second drive combs face toward each other. A parallel plate sense electrode is located under the proof mass on the support substrate. The drive combs and the parallel plate sense electrode are each electrically charged and configured with respect to the proof mass such that a combination of a levitation force and a parallel plate force produces a linear out-of-plane actuation that depends only on an applied voltage.

MEMS out of plane actuator

An embodiment of a gyroscope subsystem that is configured to reduce, or to eliminate, the effect of bias includes a gyroscope assembly, a calibration assembly, a determining circuit, and a bias-reducing circuit. The gyroscope assembly is configured to generate a gyroscope signal in response to a calibration angular velocity and another angular velocity about a sense axis, and the calibration assembly is configured to generate, about the sense axis, the calibration angular velocity. The determining circuit is configured to determine the other angular velocity in response to the gyroscope signal, and the bias-reducing circuit is configured to reduce a bias component of the determined other angular velocity in response to the gyroscope signal. For example, such a gyroscope subsystem can yield a value of an angular velocity having a bias component that is significantly less than the bias component of a value yielded by a conventional gyroscope subsystem.

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Vienna, Austria

Mikulas Jandak