Parker-Hannifin Corporation

Miksa De Sorgo

Michael H Bunyan

George R Watchko

William G Lionetta

Matthew T Gagnon

Peter W Liu

Christian V Rodriguez

Scott M Oppenheim

Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An of the compound is dispensed from a nozzle or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound.

Thermally or electrically-conductive form-in-place gap filter

Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.

Thermal-sprayed metallic conformal coatings used as heat spreaders

A thermal dissipator disposable in a heat transfer relationship with a heat-generating source, such as an electronic component, which is mounted on a substrate, such as a printed circuit board. The dissipator includes a thermal dissipation member having a top and bottom surface, and a pressure sensitive adhesive layer disposed on the thermal dissipation member to cover at-least a portion of the bottom surface thereof. The dissipation member is formed of a thermally-conductive, electrically-nonconductive ceramic material. The pressure sensitive adhesive layer has an inner surface adhered to the bottom surface of the thermal dissipation member, and an outer surface bondable to a heat transfer surface of the source for attaching the dissipator to the source in a heat transfer relationship therewith.

Non-electrically conductive thermal dissipator for electronic components

A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.

Conformal thermal interface material for electronic components

Conductive cooling of a heat-generating electronic component disposable in spaced-apart adjacency with a surface of a thermal dissipation member to define a gap of predetermined width therebetween. A curable composition is provided as formed of an electrically-insulating polymeric binder having thermally-conductive, electrically-insulating filler particles dispersed therein. At least a portion of the filler particles is of a maximum average diameter about equal to the predetermined width of the gap. A layer of the composition is disposable in conductive heat transfer contact with the electronic component and the surface of the thermal dissipation member, and is cured to form an interlayer within the gap. At least a portion of the filler particles of the specified maximum average diameter each substantially directly contact the electronic component and the surface of the thermal dissipation member to establish thermally-conductive pathways effective to transfer heat from the electronic component to the heat dissipation member.

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Middlesex, NH, United States of America

Miksa De Sorgo