Robert Boschgmbh

Mikko Va Suvanto

Sucheendran Sridharan

Eric Bauer

A coating for protecting a wafer from moisture and debris due to dicing, singulating, or handling the wafer is provided. A semiconductor sensor device comprises a wafer having a surface and at least one trench feature and the protective coating covering the trench feature. The trench feature comprises a plurality of walls and the walls are covered with the protective coating, wherein the walls of the trench feature are formed as a portion of the semiconductor sensor device. The semiconductor sensor device further comprises a patterned mask formed on the wafer before the trench feature is formed, wherein the protective coating is formed directly to the trench feature and the patterned mask. The semiconductor sensor device is selected from a group consisting of a MEMS die, a sensor die, a sensor circuit die, a circuit die, a pressure die, an accelerometer, a gyroscope, a microphone, a speaker, a transducer, an optical sensor, a gas sensor, a bolometer, a giant magnetoresistive sensor (GMR), a tunnel magnetoresistive (TMR) sensor, an environmental sensor, and a temperature sensor.

Protective coating on trench features of a wafer and method of fabrication thereof

A microelectromechanical system (MEMS) sensor device includes a package housing having a top member, bottom member, and a spacer coupled the top member to the bottom member, defining a cavity. At least one sensor circuit and a MEMS sensor disposed within the cavity of the package housing. A first opening formed on the package housing a control device embedded within the package housing is electrically coupled to the sensor circuit and is controlled to tune the MEMS sensor from a directional mode to an omni-directional mode.

MEMS sensor device package housing with an embedded controllable device

An adjustable microphone. The microphone includes a MEMS microphone, a charge pump, a preamplifier, a first analog-to-digital converter, a root mean square (RMS) power detector, and a logic circuit. The MEMS microphone is configured to provide a signal indicative of sound detected by the MEMS microphone. The charge pump provides a bias voltage to the MEMS microphone. The preamplifier receives the signal from the MEMS microphone, and outputs an amplified signal indicative of sound detected by the MEMS microphone. The first analog-to-digital converter receives the amplified signal and converts the amplified signal to a digital signal. The root mean square power detector is configured to detect a power level of the amplified signal and output an indication of the power of the amplified signal. The logic circuit receives the RMS power detector output and a control input, and adjusts the operation of the microphone based on the control input.

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Pittsburgh, PA, United States of America

Mikko Va Suvanto