Panasonic Corporation

Mikiya Ueda

Atsushi Yamaguchi

Shigeaki Sakatani

Hidenori Miyakawa

Koso Matsuno

Yoshiaki Akutagawa

Chikanori Miyawaki

In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.

Mounting structure for semiconductor element with underfill resin

A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.

Structure with electronic component mounted therein and method for manufacturing such structure

Growing community of inventors

Osaka, Japan

Mikiya Ueda