Shinko Electric Industries Co., Ltd.

Nichia Corporation

Mikio Suyama

Kazuma Kozuru

Eiichiro Okahisa

Yasuyuki Kimura

Shigeru Matsushita

Misuzu Machii

An electronic component package includes: a metal plate; a metal wall that is disposed on the metal plate; a metal frame that is disposed on the metal plate so as to be opposed to the metal wall; a through hole that is formed in the metal wall; an opening hole that is formed in the metal frame so as to be opposed to the through hole; and a lead that is hermetically sealed with a sealing portion provided in the through hole, and that is inserted into the opening hole and the through hole. The metal frame includes: a side plate that is opposed to the metal wall; a bent portion that is connected to the side plate and has a round shape; and a welding portion that is connected to the bent portion and to which a lid member is to be bonded.

Electronic component package and electronic component device

An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.

Optical semiconductor element package and optical semiconductor device

Growing community of inventors

Nagano, Japan

Mikio Suyama